Product Overview
The emi shielding film is a high-performance material made of beryllium copper, offering advanced technology and diverse material choices for EMC shielding applications.
Product Features
The film is non-conductive, double-sided, with adhesive properties suitable for temperatures ranging from -40°C to 121°C. It is moisture, solvent, and temperature tolerant, meeting MIL standard specifications.
Product Value
The product uses high-quality beryllium copper material, imported from the USA and provides various choices for stamping materials, ensuring high hardness and effectiveness for EMC shielding.
Product Advantages
The beryllium copper shrapnel used in the film offers several advantages such as low compression force, high strength with a long cycle life, excellent conductivity, dimensional stability, and resistance to stress relaxation, making it ideal for various applications.
Application Scenarios
The emi shielding film can be used in shielding rooms, chassis doors, cover plates, printed board inserts, and integrated circuit shielding, offering easy installation and a variety of mounting options, sizes, and configurations for different applications.
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