Product Overview
Wholesale heat conductive pad for sublimation is a soft and compressible material with good thermal conductivity and insulation performance, suitable for filling gaps in electronic and mechanical equipment.
Product Features
It has natural viscosity on both sides, reduces contact thermal resistance, and can be used in a wide range of thicknesses for applications.
Product Value
The product provides a solution for improving heat transfer and filling thermal gaps in various equipment, with a one-year quality guarantee period after manufacturing.
Product Advantages
It can effectively squeeze air out of contact surfaces, has a high thermal conductivity of 3-8 W/m.K, and a temperature resistance of -50~200℃.
Application Scenarios
It is suitable for use in the mainboard of electronic products, inside motors, and in electrical, automotive, mechanical, computer, laptop, DVD, VCD equipment, as well as any equipment that requires filling thermal gaps and installing heat dissipation modules.
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