With the rapid advancement of technology, the consumer electronics industry demands increasingly higher performance standards. In particular, traditional SMT conductive elastic gaskets have become inadequate for specific applications in electromagnetic shielding and conductive connectivity. Leveraging profound material research capabilities, Konlida has successfully developed a low-pressure, high-resilience conductive foam, bringing a revolutionary solution to the consumer electronics industry.

With the rapid advancement of technology, the consumer electronics industry demands increasingly higher performance standards. In particular, traditional SMT conductive elastic gaskets have become inadequate for specific applications in electromagnetic shielding and conductive connectivity. Leveraging profound material research capabilities, Konlida has successfully developed a low-pressure, high-resilience conductive foam, bringing a revolutionary solution to the consumer electronics industry.

With the rapid advancement of technology, the consumer electronics industry demands increasingly higher performance standards. In particular, traditional SMT conductive elastic gaskets have become inadequate for specific applications in electromagnetic shielding and conductive connectivity. Leveraging profound material research capabilities, Konlida has successfully developed a low-pressure, high-resilience conductive foam, bringing a revolutionary solution to the consumer electronics industry.

With the rapid advancement of technology, the consumer electronics industry demands increasingly higher performance standards. In particular, traditional SMT conductive elastic gaskets have become inadequate for specific applications in electromagnetic shielding and conductive connectivity. Leveraging profound material research capabilities, Konlida has successfully developed a low-pressure, high-resilience conductive foam, bringing a revolutionary solution to the consumer electronics industry.

Conventional conductive foam is single-piece typesetting, and the layout position requirements are not high.

This is a patch of conductive silicone foam that can be attached to a PCB using the SMT process. It has good electrical conductivity and excellent elasticity after reflow soldering and can be used as an EMI shielding ground or as an alternative to mechanical antenna shrapnel. At the same time, when the whole machine is subjected to external impact force, the product has a buffering function to avoid damage to other components by the impact force.