Conductive Polyimide Film combines the exceptional thermal, mechanical, and chemical stability of standard PI film with enhanced electrical conductivity. By depositing metal layers such as copper, nickel, or gold onto the PI surface, the film achieves superior EMI shielding and grounding performance while maintaining flexibility and durability.
It is widely used in automotive electronics, communication devices, computer systems, and automatic control equipment.
Excellent EMI Shielding: Provides effective electromagnetic protection for sensitive circuits.
High Flexibility: Maintains stability and conductivity even under bending or vibration.
Thermal Resistance: Performs reliably from -40°C to 200°C, suitable for harsh environments.
Chemical & Moisture Resistance: Withstands corrosion, humidity, and solvents.
Lightweight & Easy to Process: Ideal for die-cutting, laminating, or integration into flexible assemblies.
Cost-Effective Performance: Optimized coating composition for superior value.
| Gold-plated PI Film | ||
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| Materials | Polyimide+Cu+Ni+Au | |
| Thickness | 27μm (Customized) | |
| Surface Resistance | ≤0.06Ω/inch² | |
| Working Temperature | -40 ~ 200℃ | |
| Shielding Efficiency | 70-100(10MHz-1GHz) | |
| Tin-plated PI Film | ||
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| Materials | Polyimide+Cu+Sn | |
| Thickness | 25μm (Customized) | |
| Surface Resistance | ≤0.06Ω/inch² | |
| Working Temperature | -40 ~ 150℃ | |
| ROHS Requirement | Halogen-free | |
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