A PCB shielding can, also known as a board-level shield, is a metal enclosure soldered or attached directly to a printed circuit board (PCB) to form a mini Faraday cage around selected circuitry. These cans — available in one-piece or two-piece designs — connect to ground to reflect and absorb EMI, improving EMC and signal integrity. One-piece soldered cans offer high shielding effectiveness and mechanical rigidity, while two-piece versions support rework and inspection without desoldering.
An EMI shielding can (or “shield can”) is a standalone metal enclosure placed over sensitive components on a PCB to block electromagnetic interference. Acting like a Faraday cage, it absorbs or reflects EMI into ground, protecting critical chips from external and internal noise. These cans can be designed for surface-mount or through-hole mounting, and may include vents or multi-cavity structures to balance shielding and thermal dissipation.
Combined thermal + EMI needs: when both heat dissipation and electromagnetic shielding must be addressed in one solution.
A PCB shielding can, also known as a board-level shield, is a metal enclosure soldered or attached directly to a printed circuit board (PCB) to form a mini Faraday cage around selected circuitry. These cans — available in one-piece or two-piece designs — connect to ground to reflect and absorb EMI, improving EMC and signal integrity. One-piece soldered cans offer high shielding effectiveness and mechanical rigidity, while two-piece versions support rework and inspection without desoldering.
An EMI shielding can (or “shield can”) is a standalone metal enclosure placed over sensitive components on a PCB to block electromagnetic interference. Acting like a Faraday cage, it absorbs or reflects EMI into ground, protecting critical chips from external and internal noise. These cans can be designed for surface-mount or through-hole mounting, and may include vents or multi-cavity structures to balance shielding and thermal dissipation.
Combined thermal + EMI needs: when both heat dissipation and electromagnetic shielding must be addressed in one solution.
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