Beryllium copper finger-stock provides an ideal combination of high electrical conductivity, long-lasting spring performance, and low contact resistance, making it one of the most reliable solutions for EMI/RFI shielding and grounding. Its resilient “memory” ensures consistent compression over thousands of cycles, while optional plated finishes improve corrosion resistance and galvanic compatibility. The natural wiping action during engagement enhances contact integrity, delivering stable, high-performance shielding in demanding environments.










