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Why EMI Matters in Electronic Communications

As data-rates increase and frequencies enter the mmWave band, even tiny gaps or sub-optimal materials can become significant EMI leakage paths — risking performance, compliance, and time-to-market.

Why EMI Matters in Electronic Communications
High-Frequency Noise
5G NR, Wi-Fi 6E/7 and high-speed SerDes generate wide-band EMI that must be controlled to ensure clean signal performance.
Dense PCB Layouts
High-density PCB layouts increase RF/analog/digital crosstalk, leading to higher BER and reduced system reliability.
Metal Enclosure Gaps
Even 0.5 mm enclosure gaps can leak GHz-range radiation, risking radiated-emissions or EMC compliance failures.
Thermal + EMI Co-Design Challenges
Heatsinks and airflow structures can disrupt shielding continuity, requiring careful balance of thermal and EMI design.
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🔍 Searchers often ask: “How to shield 5G mmWave antenna?” / “EMI gasket for optical transceiver” / “Conductive foam for server chassis”

Why EMI Matters in Electronic Communications

As data-rates increase and frequencies enter the mmWave band, even tiny gaps or sub-optimal materials can become significant EMI leakage paths — risking performance, compliance, and time-to-market.

High-Frequency Noise
5G NR, Wi-Fi 6E/7 and high-speed SerDes generate wide-band EMI that must be controlled to ensure clean signal performance.
Dense PCB Layouts
High-density PCB layouts increase RF/analog/digital crosstalk, leading to higher BER and reduced system reliability.
Metal Enclosure Gaps
Even 0.5 mm enclosure gaps can leak GHz-range radiation, risking radiated-emissions or EMC compliance failures.
Thermal + EMI Co-Design Challenges
Heatsinks and airflow structures can disrupt shielding continuity, requiring careful balance of thermal and EMI design.
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🔍 Searchers often ask: “How to shield 5G mmWave antenna?” / “EMI gasket for optical transceiver” / “Conductive foam for server chassis”

KONLIDA Communication Industry EMI Solutions

Konlida delivers full-stack EMI solutions for high-frequency, high-density communication devices — with superior shielding, ultra-thin profiles, and full compatibility with automated production.

High-Speed Optical Transceivers
EMI from laser drivers can cause crosstalk in dense multi-lane modules.
SMT Gasket: SMT-compatible, ultra-low contact resistance; delivers ~80 dB shielding (1–10 GHz), proven in leading optical transceiver modules.
5G Base Stations & RF Units (AAU / RRU)
PA noise leaks through enclosure gaps; outdoor units face large temperature swings.
Conductive Silicone Rubber: –40 °C to +125 °C, UL94 V-0, ≥60 dB up to 10 GHz, customizable for complex flanges and harsh environments.
Servers & Data Center Equipment
Cavity resonance and ventilation openings degrade high-speed signal integrity.
High-Rebound Conductive Foam: ~15% compression set, strong resilience, stable long-term shielding for serviceable panels and data-center enclosures.
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KONLIDA Communication Industry EMI Solutions

Konlida delivers full-stack EMI solutions for high-frequency, high-density communication devices — with superior shielding, ultra-thin profiles, and full compatibility with automated production.

High-Speed Optical Transceivers
EMI from laser drivers can cause crosstalk in dense multi-lane modules.
SMT Gasket: SMT-compatible, ultra-low contact resistance; delivers ~80 dB shielding (1–10 GHz), proven in leading optical transceiver modules.
5G Base Stations & RF Units (AAU / RRU)
PA noise leaks through enclosure gaps; outdoor units face large temperature swings.
Conductive Silicone Rubber: –40 °C to +125 °C, UL94 V-0, ≥60 dB up to 10 GHz, customizable for complex flanges and harsh environments.
Servers & Data Center Equipment
Cavity resonance and ventilation openings degrade high-speed signal integrity.
High-Rebound Conductive Foam: ~15% compression set, strong resilience, stable long-term shielding for serviceable panels and data-center enclosures.
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Why choose Konlida?

Technical Advantages Aligned with Communication Needs

60–90 dB from 30 MHz to 10 GHz
Materials stable under 7x24 operation in data centers
SMT gasket supports high-speed pick-and-place assembly
Meets FCC Part 15, CE RED, Telcordia GR-1089
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Proven in Real Deployments

1
Global Optical Module Manufacturer

“Konlida's SMT gasket reduced EMI noise by 18dB in our 800G OSFP module, enabling first-pass compliance with IEEE 802.3df.”

2
Top 3 Telecom Infrastructure Provider
“Their silicone gasket solved persistent leakage at the 5G AAU cover joint, even after 1,000 thermal cycles.”
3
Leading Hyperscale Data Center Operator

“Konlida's high-rebound conductive foam eliminated cavity-resonance peaks in our accelerator server, reducing EMI by 20dB from 2–8GHz while maintaining full airflow efficiency.”

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Proven in Real Deployments

1
Global Optical Module Manufacturer

“Konlida's SMT gasket reduced EMI noise by 18dB in our 800G OSFP module, enabling first-pass compliance with IEEE 802.3df.”

2
Top 3 Telecom Infrastructure Provider
“Their silicone gasket solved persistent leakage at the 5G AAU cover joint, even after 1,000 thermal cycles.”
3
Leading Hyperscale Data Center Operator

“Konlida's high-rebound conductive foam eliminated cavity-resonance peaks in our accelerator server, reducing EMI by 20dB from 2–8GHz while maintaining full airflow efficiency.”

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Need an EMI solution for your communication product?

Just leave your email or phone number in the contact form so we can send you a free quote for our wide range of designs!
Expert In Custom Solutions For More Efficient Electromagnetic Shielding Components
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Mob:+86 189 1365 7912
Tel: +86 0512-66563293-8010
Address: 88 Dongxin Road, Xukou Town, Wuzhong District, Suzhou City, Jiangsu Province, China

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