EMI Shielding Solutions for 5G & Datacom

Why EMI Matters in Electronic Communications

As data-rates increase and frequencies enter the mmWave band, even tiny gaps or sub-optimal materials can become significant EMI leakage paths — risking performance, compliance, and time-to-market.

High-Frequency Noise

5G NR, Wi-Fi 6E/7 and high-speed SerDes generate wide-band EMI that must be controlled to ensure clean signal performance.

Dense PCB Layouts

High-density PCB layouts increase RF/analog/digital crosstalk, leading to higher BER and reduced system reliability.

Metal Enclosure Gaps

Even 0.5 mm enclosure gaps can leak GHz-range radiation, risking radiated-emissions or EMC compliance failures.

Thermal + EMI Co-Design Challenges

Heatsinks and airflow structures can disrupt shielding continuity, requiring careful balance of thermal and EMI design.

🔍 Searchers often ask: “How to shield 5G mmWave antenna?” / “EMI gasket for optical transceiver” / “Conductive foam for server chassis”

Our Core EMI Material Platforms

Engineered Conductive Foam

The go-to solution for dynamic gaps and environmental sealing

What it is: Open-cell polyurethane foam with multi-layer metal coating (Ni/Cu or Ag)
Why it matters in communication systems:
Provides consistent electrical contact across mating surfaces under vibration and thermal cycling
Absorbs mechanical tolerance in large enclosures (e.g., base station housings)
Cost-effective for high-volume deployments
Key Differentiators:
Low outgassing: TML < 0.1% (ASTM E595) — safe near optical components
Non-corrosive formulation: Passes Telcordia GR-468 copper mirror test
Controlled compression set: <15% after 1,000h @ 125°C (ISO 815)
Typical Applications:
5G macro/small cell enclosures
Data center server PSU compartments
Industrial router and switch chassis
Available as die-cut gaskets, continuous strips, or Y-axis wrapped profiles

Engineered Conductive Foam

The go-to solution for dynamic gaps and environmental sealing

What it is: Open-cell polyurethane foam with multi-layer metal coating (Ni/Cu or Ag)
Why it matters in communication systems:
Provides consistent electrical contact across mating surfaces under vibration and thermal cycling
Absorbs mechanical tolerance in large enclosures (e.g., base station housings)
Cost-effective for high-volume deployments
Key Differentiators:
Low outgassing: TML < 0.1% (ASTM E595) — safe near optical components
Non-corrosive formulation: Passes Telcordia GR-468 copper mirror test
Controlled compression set: <15% after 1,000h @ 125°C (ISO 815)
Typical Applications:
5G macro/small cell enclosures
Data center server PSU compartments
Industrial router and switch chassis
Available as die-cut gaskets, continuous strips, or Y-axis wrapped profiles

Ultra-Thin Conductive Films (PI/PET-based)

For sub-0.3 mm gaps and SMT-compatible shielding

Thickness: 0.025–0.1 mm
Withstands 260°C reflow
SE >75 dB up to 10 GHz
Used in: 5G front-end modules, 800G optical cages, camera shields

Ultra-Thin Conductive Films (PI/PET-based)

For sub-0.3 mm gaps and SMT-compatible shielding

Thickness: 0.025–0.1 mm
Withstands 260°C reflow
SE >75 dB up to 10 GHz
Used in: 5G front-end modules, 800G optical cages, camera shields

Hybrid Thermal-EMI Materials

When heat and noise coexist

Graphite-copper mesh + soft interface
In-plane thermal conductivity >450 W/m·K + Z-axis EMI shielding
Ideal for GaN PAs, GPU brackets, battery management units

Hybrid Thermal-EMI Materials

When heat and noise coexist

Graphite-copper mesh + soft interface
In-plane thermal conductivity >450 W/m·K + Z-axis EMI shielding
Ideal for GaN PAs, GPU brackets, battery management units

Performance Comparison: Choosing the Right Material

Requirement	Best Material	Why
Gap >0.5 mm, dynamic seal	Conductive Foam	Compressibility absorbs tolerance
Gap <0.3 mm, near optics	Conductive Film	No outgassing, ultra-thin
High temp (>150°C)	Conductive Film	Foam degrades above 125°C
Outdoor, humid environment	Non-corrosive Foam or Elastomer	Resists galvanic corrosion
Need heat spreading + EMI	Hybrid Material	Dual functionality

Validation Data for Conductive Foam (Telecom Grade)

Test	Standard	Result
Shielding Effectiveness	ASTM D4935	82 dB @ 1 GHz
Outgassing	ASTM E595	TML = 0.08%
Compression Set	ISO 815-B	12% after 1,000h @ 125°C
Corrosivity	Telcordia GR-468	Pass (no sulfur/chlorine)
Flammability	UL 94	V-0

Why EMI Matters in Electronic Communications

As data-rates increase and frequencies enter the mmWave band, even tiny gaps or sub-optimal materials can become significant EMI leakage paths — risking performance, compliance, and time-to-market.

High-Frequency Noise

5G NR, Wi-Fi 6E/7 and high-speed SerDes generate wide-band EMI that must be controlled to ensure clean signal performance.

Dense PCB Layouts

High-density PCB layouts increase RF/analog/digital crosstalk, leading to higher BER and reduced system reliability.

Metal Enclosure Gaps

Even 0.5 mm enclosure gaps can leak GHz-range radiation, risking radiated-emissions or EMC compliance failures.

Thermal + EMI Co-Design Challenges

Heatsinks and airflow structures can disrupt shielding continuity, requiring careful balance of thermal and EMI design.

🔍 Searchers often ask: “How to shield 5G mmWave antenna?” / “EMI gasket for optical transceiver” / “Conductive foam for server chassis”

KONLIDA Communication Industry EMI Solutions

Konlida delivers full-stack EMI solutions for high-frequency, high-density communication devices — with superior shielding, ultra-thin profiles, and full compatibility with automated production.

High-Speed Optical Transceivers

EMI from laser drivers can cause crosstalk in dense multi-lane modules.

SMT Gasket: SMT-compatible, ultra-low contact resistance; delivers ~80 dB shielding (1–10 GHz), proven in leading optical transceiver modules.

5G Base Stations & RF Units (AAU / RRU)

PA noise leaks through enclosure gaps; outdoor units face large temperature swings.

Conductive Silicone Rubber: –40 °C to +125 °C, UL94 V-0, ≥60 dB up to 10 GHz, customizable for complex flanges and harsh environments.

Servers & Data Center Equipment

Cavity resonance and ventilation openings degrade high-speed signal integrity.

High-Rebound Conductive Foam: ~15% compression set, strong resilience, stable long-term shielding for serviceable panels and data-center enclosures.

KONLIDA Communication Industry EMI Solutions

Konlida delivers full-stack EMI solutions for high-frequency, high-density communication devices — with superior shielding, ultra-thin profiles, and full compatibility with automated production.

High-Speed Optical Transceivers

EMI from laser drivers can cause crosstalk in dense multi-lane modules.

SMT Gasket: SMT-compatible, ultra-low contact resistance; delivers ~80 dB shielding (1–10 GHz), proven in leading optical transceiver modules.

5G Base Stations & RF Units (AAU / RRU)

PA noise leaks through enclosure gaps; outdoor units face large temperature swings.

Conductive Silicone Rubber: –40 °C to +125 °C, UL94 V-0, ≥60 dB up to 10 GHz, customizable for complex flanges and harsh environments.

Servers & Data Center Equipment

Cavity resonance and ventilation openings degrade high-speed signal integrity.

High-Rebound Conductive Foam: ~15% compression set, strong resilience, stable long-term shielding for serviceable panels and data-center enclosures.

Why choose Konlida?

Technical Advantages Aligned with Communication Needs

Ultra-Wideband Shielding

60–90 dB from 30 MHz to 10 GHz

Thermal Stability

Materials stable under 7x24 operation in data centers

Automation Ready

SMT gasket supports high-speed pick-and-place assembly

Global Compliance

Meets FCC Part 15, CE RED, Telcordia GR-1089

Proven in Real Deployments

Global Optical Module Manufacturer

“Konlida's SMT gasket reduced EMI noise by 18dB in our 800G OSFP module, enabling first-pass compliance with IEEE 802.3df.”

Top 3 Telecom Infrastructure Provider

“Their silicone gasket solved persistent leakage at the 5G AAU cover joint, even after 1,000 thermal cycles.”

Leading Hyperscale Data Center Operator