As data-rates increase and frequencies enter the mmWave band, even tiny gaps or sub-optimal materials can become significant EMI leakage paths — risking performance, compliance, and time-to-market.
Konlida delivers full-stack EMI solutions for high-frequency, high-density communication devices — with superior shielding, ultra-thin profiles, and full compatibility with automated production.
“Konlida's SMT gasket reduced EMI noise by 18dB in our 800G OSFP module, enabling first-pass compliance with IEEE 802.3df.”
“Konlida's high-rebound conductive foam eliminated cavity-resonance peaks in our accelerator server, reducing EMI by 20dB from 2–8GHz while maintaining full airflow efficiency.”
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