Premium EMI Shielding for Flagship Smartphones & Wearables

Why EMI Matters in Electronic Communications

Challenge	Impact
Ultra-thin Design	Cavity gaps often <0.8mm, making traditional shielding solutions impossible to install
Multi-frequency Coexistence	5G + Wi-Fi 6E + Bluetooth LE + NFC → High risk of mutual interference
Wireless Charging & High-Speed Interfaces	Qi coils and USB4/Thunderbolt generate strong electromagnetic radiation
Metal/Glass Integrated Chassis	Limited antenna clear zone; shielding must seamlessly integrate with industrial design (ID)
Automated Assembly	Materials must support high-speed pick-and-place and withstand 260°C reflow soldering

🔍 Common engineer searches: “ultra-thin EMI gasket for iPhone”, “SMT foam for AR glasses”, “non-magnetic shielding for smartwatch”

Premium EMI Solutions for High-End Consumer Electronics

Smartphones & Tablets

TWS Active Noise-Canceling (ANC) Earbuds & Smartwatches

Pain Points:

5G/Wi-Fi coexistence interference, EMI leakage from camera modules, noise from wireless charging systems

Solutions:

Pain Points:

Dense integration of Bluetooth radios and sensors on miniature PCBs leads to audio distortion or inaccurate heart rate readings due to EMI

Solutions:

AIR LOOP™ Ultra-Thin Gasket

SMT Gasket

Thickness 0.65–0.95 mm, shielding effectiveness >80 dB (1–10 GHz)

Withstands 260°C reflow soldering, contact resistance <0.1 Ω — ideal for localized shielding of SoC and RF modules

Micro-Die-Cut Conductive Foam

Non-Magnetic Conductive Tape

Tolerance ±0.05 mm, low compression force — optimized for plastic housings

Eliminates interference with Hall sensors, compasses, and optical heart rate monitors

Wireless Charging Modules & Battery Systems

Pain Points:

Wideband EMI radiation generated by high-refresh-rate displays and high-speed data interfaces (e.g., DisplayPort over USB4)

Solutions:

Pain Points:

Magnetic fields from Qi coils interfere with adjacent circuits

Solutions:

AIR LOOP™ Ultra-Thin Gasket

Thermally Conductive EMI Pads

Bendable to conform to curved surfaces, shielding effectiveness >75 dB

Dual-function solution for EMI suppression and thermal management (thermal conductivity: 1.2 W/m·K)

Multi-Layer Shielding Film

Combines a graphene-based conductive layer with a ferrite absorber layer to achieve dual-mode suppression — reflection + absorption

Pain Points:

5G/Wi-Fi coexistence interference, EMI leakage from camera modules, noise from wireless charging systems

Solutions:

AIR LOOP™ Ultra-Thin Gasket:

Thickness 0.65–0.95 mm, shielding effectiveness >80 dB (1–10 GHz)

SMT Conductive Foam:

Withstands 260°C reflow soldering, contact resistance less than 0.1 Ω — ideal for localized shielding of SoC and RF modules

Smartphones & Tablets

Pain Points:

Dense integration of Bluetooth radios and sensors on miniature PCBs leads to audio distortion or inaccurate heart rate readings due to EMI

Solutions:

Micro-Die-Cut Conductive Foam

Tolerance ±0.05 mm, low compression force — optimized for plastic housings

Non-Magnetic Conductive Tape:

Eliminates interference with Hall sensors, compasses, and optical heart rate monitors

AR/VR Headsets & Ultrabooks

Pain Points:

Wideband EMI radiation generated by high-refresh-rate displays and high-speed data interfaces (e.g., DisplayPort over USB4)

Solutions:

Flexible FOF (Fabric-over-Foam):

TBendable to conform to curved surfaces, shielding effectiveness >75 dB

Thermally Conductive EMI Pads:

Dual-function solution for EMI suppression and thermal management (thermal conductivity: 1.2 W/m·K)

AR/VR Headsets & Ultrabooks

Pain Points:

Magnetic fields from Qi coils interfere with adjacent circuits

Solutions:

Multi-Layer Shielding Film:

Combines a graphene-based conductive layer with a ferrite absorber layer to achieve dual-mode suppression — reflection + absorption

Why choose Konlida?

Technical Advantages Aligned with Communication Needs

Ultra-Wideband Shielding

60–90 dB from 30 MHz to 10 GHz

Thermal Stability

Materials stable under 7x24 operation in data centers

Automation Ready

SMT gasket supports high-speed pick-and-place assembly

Global Compliance

Meets FCC Part 15, CE RED, Telcordia GR-1089

Proven in Real Deployments

Global Optical Module Manufacturer

“Konlida's SMT gasket reduced EMI noise by 18dB in our 800G OSFP module, enabling first-pass compliance with IEEE 802.3df.”

Top 3 Telecom Infrastructure Provider

“Their silicone gasket solved persistent leakage at the 5G AAU cover joint, even after 1,000 thermal cycles.”

Leading Hyperscale Data Center Operator

“Konlida's high-rebound conductive foam eliminated cavity-resonance peaks in our accelerator server, reducing EMI by 20dB from 2–8GHz while maintaining full airflow efficiency.”

Proven in Real Deployments

Global Optical Module Manufacturer

“Konlida's SMT gasket reduced EMI noise by 18dB in our 800G OSFP module, enabling first-pass compliance with IEEE 802.3df.”

Top 3 Telecom Infrastructure Provider

“Their silicone gasket solved persistent leakage at the 5G AAU cover joint, even after 1,000 thermal cycles.”

Leading Hyperscale Data Center Operator

“Konlida's high-rebound conductive foam eliminated cavity-resonance peaks in our accelerator server, reducing EMI by 20dB from 2–8GHz while maintaining full airflow efficiency.”