Consumer Electronics

Why EMI Matters in Electronic Communications

Challenge	Impact
Ultra-thin Design	Cavity gaps often <0.8mm, making traditional shielding solutions impossible to install
Multi-frequency Coexistence	5G + Wi-Fi 6E + Bluetooth LE + NFC → High risk of mutual interference
Wireless Charging & High-Speed Interfaces	Qi coils and USB4/Thunderbolt generate strong electromagnetic radiation
Metal/Glass Integrated Chassis	Limited antenna clear zone; shielding must seamlessly integrate with industrial design (ID)
Automated Assembly	Materials must support high-speed pick-and-place and withstand 260°C reflow soldering

🔍 Common engineer searches: “ultra-thin EMI

gasket

for iPhone”, “SMT

foam

for AR glasses”, “non-magnetic

shielding

for smartwatch”

Premium EMI Solutions for High-End Consumer Electronics

Flagship Smartphones & Tablets

TWS Active Noise-Canceling (ANC) Earbuds & Smartwatches

Pain Points:

5G/Wi-Fi coexistence interference, EMI leakage from camera modules, noise from wireless charging systems

Solutions:

Pain Points:

Dense integration of Bluetooth radios and sensors on miniature PCBs leads to audio distortion or inaccurate heart rate readings due to EMI

Solutions:

AIR LOOP™ Ultra-Thin Gasket

SMT Conductive Foam

Thickness 0.65–0.95 mm, shielding effectiveness >80 dB (1–10 GHz)

Withstands 260°C reflow soldering, contact resistance <0.1 Ω — ideal for localized shielding of SoC and RF modules

Micro-Die-Cut Conductive Foam

Non-Magnetic Conductive Tape

Tolerance ±0.05 mm, low compression force — optimized for plastic housings

Eliminates interference with Hall sensors, compasses, and optical heart rate monitors

Wireless Charging Modules & Battery Systems

Pain Points:

Wideband EMI radiation generated by high-refresh-rate displays and high-speed data interfaces (e.g., DisplayPort over USB4)

Solutions:

Pain Points:

Magnetic fields from Qi coils interfere with adjacent circuits

Solutions:

AIR LOOP™ Ultra-Thin Gasket

Thermally Conductive EMI Pads

Bendable to conform to curved surfaces, shielding effectiveness >75 dB

Dual-function solution for EMI suppression and thermal management (thermal conductivity: 1.2 W/m·K)

Multi-Layer Shielding Film

Combines a graphene-based conductive layer with a ferrite absorber layer to achieve dual-mode suppression — reflection + absorption

Why choose Konlida?

Technical Advantages Aligned with Communication Needs

Ultra-Wideband Shielding

60–90 dB from 30 MHz to 10 GHz

Thermal Stability

Materials stable under 7x24 operation in data centers

Automation Ready

SMT gasket supports high-speed pick-and-place assembly

Global Compliance

Meets FCC Part 15, CE RED, Telcordia GR-1089

Proven in Real Deployments

Global Optical Module Manufacturer

“Konlida's SMT gasket reduced EMI noise by 18dB in our 800G OSFP module, enabling first-pass compliance with IEEE 802.3df.”

Top 3 Telecom Infrastructure Provider

“Their silicone gasket solved persistent leakage at the 5G AAU cover joint, even after 1,000 thermal cycles.”

Leading Hyperscale Data Center Operator

“Konlida's high-rebound conductive foam eliminated cavity-resonance peaks in our accelerator server, reducing EMI by 20dB from 2–8GHz while maintaining full airflow efficiency.”