AI Cloud Servers

EMI Shielding Engineered for the Extreme Demands of AI Cloud Infrastructure

Modern AI cloud servers pack thousands of high-power GPUs/TPUs, ultra-fast interconnects (PCIe 5.0, NVLink, 800G Ethernet), and dense power delivery systems into compact 4U–8U chassis. In such environments, even minor EMI can caus

Bit errors in high-speed SerDes links → training job failures
Crosstalk between GPU lanes → reduced throughput
False triggers in BMC/IPMI → unexpected node reboots
Radiated emissions exceeding FCC Class A limits

Konlida’s AI-server-optimized EMI materials deliver ultra-clean, thermally stable, and non-corrosive shielding—ensuring signal integrity, regulatory compliance, and 99.999% uptime in mission-critical AI workloads.

Unique EMI Challenges of AI Cloud Servers

Challenge	Impact
Ultra-High-Speed Signals (>32 GT/s)	Extremely sensitive to dielectric properties of shielding materials
High GPU/TPU Power (700W+ per chip)	Local temperatures exceed 120°C; conventional foams degrade
Dense Airflow Channels	Gaskets must withstand strong airflow, vibration, and particle impact
Copper Corrosion Risk	Sulfur/chlorine-containing materials oxidize high-speed connectors
Rapid Deployment Requirements	Materials must support automated assembly (SMT or robotic pick-and-place)

🔍 Common searches: “EMI gasket for AI server”, “low-outgassing shielding for data center”, “PCIe 5.0 EMI solution”

Konlida’s AI Cloud Server-Specific EMI Solutions

GPU/TPU Accelerator Cavity Shielding

High-Speed Interconnects (PCIe 5.0 / NVLink / OCP NICs)

Pain Point :

HBM switching noise couples into PCIe lanes, causing CRC errors

Solutions:

Pain Point :

Radiated emissions from connector gaps interfere with adjacent 800G optical modules

Solutions:

Ultra-Low Outgassing Conductive Foam

Prevents contamination of optical transceivers and heat sinks；
Stable up to 150°C — survives repeated GPU thermal throttling cycles

Non-Corrosive Formulation

Zero sulfur/chlorine — protects copper traces and gold-plated contacts

Low-Dk Conductive Elastomer

Minimizes insertion loss and impedance discontinuity；
Optimized compression force for low-insertion-force connectors

Custom Gaskets

Precision-fit for OCP 3.0/4.0 form factors

Rack-Level EMC Shielding

Pain Point :

Multi-phase VRM switching noise radiates into management networks

Solutions:

Pain Point :

Emission from a single node causes entire rack to fail certification

Solutions:

Ultra-Low Outgassing Conductive Foam

Prevents contamination of optical transceivers and heat sinks；
Stable up to 150°C — survives repeated GPU thermal throttling cycles

Non-Corrosive Formulation

Zero sulfur/chlorine — protects copper traces and gold-plated contacts

Low-Dk Conductive Elastomer

Minimizes insertion loss and impedance discontinuity；
Optimized compression force for low-insertion-force connectors

Custom Laser-Cut Gaskets

Precision-fit for OCP 3.0/4.0 form factors

Why choose Konlida?

Technical Advantages Aligned with Communication Needs

Ultra-Wideband Shielding

60–90 dB from 30 MHz to 10 GHz

Thermal Stability

Materials stable under 7x24 operation in data centers

Automation Ready

SMT gasket supports high-speed pick-and-place assembly

Global Compliance

Meets FCC Part 15, CE RED, Telcordia GR-1089

Proven in Real Deployments

Global Optical Module Manufacturer

“Konlida's SMT gasket reduced EMI noise by 18dB in our 800G OSFP module, enabling first-pass compliance with IEEE 802.3df.”

Top 3 Telecom Infrastructure Provider

“Their silicone gasket solved persistent leakage at the 5G AAU cover joint, even after 1,000 thermal cycles.”

Leading Hyperscale Data Center Operator

“Konlida's high-rebound conductive foam eliminated cavity-resonance peaks in our accelerator server, reducing EMI by 20dB from 2–8GHz while maintaining full airflow efficiency.”