EMI Shielding for AI Cloud Servers – High-Speed & Thermal-Compatible

EMI Shielding Engineered for the Extreme Demands of AI Cloud Infrastructure

Modern AI cloud servers pack thousands of high-power GPUs/TPUs, ultra-fast interconnects (PCIe 5.0, NVLink, 800G Ethernet), and dense power delivery systems into compact 4U–8U chassis. In such environments, even minor EMI can caus

Bit errors in high-speed SerDes links → training job failures
Crosstalk between GPU lanes → reduced throughput
False triggers in BMC/IPMI → unexpected node reboots
Radiated emissions exceeding FCC Class A limits

Konlida’s AI-server-optimized EMI materials deliver ultra-clean, thermally stable, and non-corrosive shielding—ensuring signal integrity, regulatory compliance, and 99.999% uptime in mission-critical AI workloads.

Unique EMI Challenges of AI Cloud Servers

Challenge	Impact
Ultra-High-Speed Signals (>32 GT/s)	Extremely sensitive to dielectric properties of shielding materials
High GPU/TPU Power (700W+ per chip)	Local temperatures exceed 120°C; conventional foams degrade
Dense Airflow Channels	Gaskets must withstand strong airflow, vibration, and particle impact
Copper Corrosion Risk	Sulfur/chlorine-containing materials oxidize high-speed connectors
Rapid Deployment Requirements	Materials must support automated assembly (SMT or robotic pick-and-place)

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Konlida’s AI Cloud Server-Specific EMI Solutions

GPU/TPU Accelerator Cavity Shielding

Pain Points:

HBM switching noise couples into PCIe lanes, causing CRC errors

Solutions:

Ultra-Low Outgassing Conductive Foam:

Prevents contamination of optical transceivers and heat sinks；
Stable up to 150°C — survives repeated GPU thermal throttling cycles

Non-Corrosive Formulation:

Zero sulfur/chlorine — protects copper traces and gold-plated contacts

High-Speed Interconnects (PCIe 5.0 / NVLink / OCP NICs)

Pain Points:

Radiated emissions from connector gaps interfere with adjacent 800G optical modules

Solutions:

Low-Dk Conductive Elastomer:

Minimizes insertion loss and impedance discontinuity；
Optimized compression force for low-insertion-force connectors

Custom Gaskets:

Precision-fit for OCP 3.0/4.0 form factors

Power Delivery Units (PDUs) & VRM Zones

Pain Points:

Multi-phase VRM switching noise radiates into management networks

Solutions:

High-Temp Conductive Fabric Over Foam:

80 dB shielding effectiveness from 100 MHz to 10 GHz；
Resistant to hydraulic fluids and cleaning solvents

Integrated EMI + Thermal Interface Option:

Combines shielding and heat transfer

Rack-Level EMC Shielding

Pain Points:

Emission from a single node causes entire rack to fail certification

Solutions:

EMI Shielding Cans:

60% open area for airflow, >60 dB shielding (1–10 GHz)

Conductive Gasket for Rack Door Seams:

IP54-compatible sealing

GPU/TPU Accelerator Cavity Shielding

High-Speed Interconnects (PCIe 5.0 / NVLink / OCP NICs)

Pain Point :

HBM switching noise couples into PCIe lanes, causing CRC errors

Solutions:

Pain Point :

Radiated emissions from connector gaps interfere with adjacent 800G optical modules

Solutions:

Ultra-Low Outgassing Conductive Foam

Prevents contamination of optical transceivers and heat sinks；
Stable up to 150°C — survives repeated GPU thermal throttling cycles

Non-Corrosive Formulation

Zero sulfur/chlorine — protects copper traces and gold-plated contacts

Low-Dk Conductive Elastomer

Minimizes insertion loss and impedance discontinuity；
Optimized compression force for low-insertion-force connectors

Custom Gaskets

Precision-fit for OCP 3.0/4.0 form factors

Rack-Level EMC Shielding

Pain Point :

Multi-phase VRM switching noise radiates into management networks

Solutions:

Pain Point :

Emission from a single node causes entire rack to fail certification

Solutions:

High-Temp Conductive Fabric Over Foam

80 dB shielding effectiveness from 100 MHz to 10 GHz；
Resistant to hydraulic fluids and cleaning solvents

Integrated EMI + Thermal Interface Option

Combines shielding and heat transfer

EMI Shielding Cans

60% open area for airflow, >60 dB shielding (1–10 GHz)

Conductive Gasket for Rack Door Seams

IP54-compatible sealing

Why choose Konlida?

Technical Advantages Aligned with Communication Needs

Ultra-Wideband Shielding

60–90 dB from 30 MHz to 10 GHz

Thermal Stability

Materials stable under 7x24 operation in data centers

Automation Ready

SMT gasket supports high-speed pick-and-place assembly

Global Compliance

Meets FCC Part 15, CE RED, Telcordia GR-1089

Proven in Real Deployments

Global Optical Module Manufacturer

“Konlida's SMT gasket reduced EMI noise by 18dB in our 800G OSFP module, enabling first-pass compliance with IEEE 802.3df.”

Top 3 Telecom Infrastructure Provider

“Their silicone gasket solved persistent leakage at the 5G AAU cover joint, even after 1,000 thermal cycles.”

Leading Hyperscale Data Center Operator

“Konlida's high-rebound conductive foam eliminated cavity-resonance peaks in our accelerator server, reducing EMI by 20dB from 2–8GHz while maintaining full airflow efficiency.”

Proven in Real Deployments

Global Optical Module Manufacturer

“Konlida's SMT gasket reduced EMI noise by 18dB in our 800G OSFP module, enabling first-pass compliance with IEEE 802.3df.”

Top 3 Telecom Infrastructure Provider

“Their silicone gasket solved persistent leakage at the 5G AAU cover joint, even after 1,000 thermal cycles.”

Leading Hyperscale Data Center Operator

“Konlida's high-rebound conductive foam eliminated cavity-resonance peaks in our accelerator server, reducing EMI by 20dB from 2–8GHz while maintaining full airflow efficiency.”