Robotics | KONLIDA

Why EMI Matters in Aerospace

Challenge	Requirement
Extreme Temperatures	Operation from –55°C to +125°C (or higher)
Vacuum & Low Outgassing	Must pass ASTM E595 (TML <1.0%, CVCM <0.1%)
Vibration & Shock	Maintain shielding integrity under 20G+ mechanical stress
Long Service Life	No degradation over 15–30 years in sealed avionics bays
Strict EMC Standards	Compliance with RTCA DO-160 Section 20, MIL-STD-461G, EUROCAE ED-14

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Konlida Aerospace EMI Solutions

Avionics & Flight Control Systems

Unmanned Aerial Vehicles (UAVs / Drones)

Application :

Radar modules, FMS, inertial navigation units

Solutions:

Application :

RF datalinks, EO/IR payloads, autopilot PCBs

Solutions:

Silicone Conductive Elastomer Gaskets

Metal-Filled Conductive Tapes

Temp range: –60°C to +200°C ；Shielding: >90 dB (100 MHz – 10 GHz) ；Flame resistance: FAR 25.853 / UL 94 V-0

For EMI sealing of access panels

Lightweight Conductive Foam

Flexible EMI Shielding Films

Density <0.4 g/cm³ — reduces payload weight ； Low magnetic permeability — avoids compass deviation ； Compatible with carbon fiber composite housings

Conformable to curved UAV fuselages

Cabin Electronics & IFE Systems

Application :

Star trackers, S-band transceivers, power distribution units

Solutions:

Application :

In-flight entertainment, passenger Wi-Fi, seat electronics

Solutions:

Ultra-Low Outgassing Conductive Gaskets

Multi-Layer EMI/RFI Absorbers

ASTM E595 certified: TML ≤0.8%, CVCM ≤0.05%； Radiation-resistant formulation (up to 100 krad)； Non-migrating, no silicone contamination

Suppress cavity resonances in compact satellite buses

Halogen-Free, Low-Smoke Conductive Foams

Meets FAA smoke density & toxicity requirements； RoHS & REACH compliant； Easy integration into modular cabin architectures

Why choose Konlida?

Technical Advantages Aligned with Communication Needs

Ultra-Wideband Shielding

60–90 dB from 30 MHz to 10 GHz

Thermal Stability

Materials stable under 7x24 operation in data centers

Automation Ready

SMT gasket supports high-speed pick-and-place assembly

Global Compliance

Meets FCC Part 15, CE RED, Telcordia GR-1089

Proven in Real Deployments

Global Optical Module Manufacturer

“Konlida's SMT gasket reduced EMI noise by 18dB in our 800G OSFP module, enabling first-pass compliance with IEEE 802.3df.”

Top 3 Telecom Infrastructure Provider

“Their silicone gasket solved persistent leakage at the 5G AAU cover joint, even after 1,000 thermal cycles.”

Leading Hyperscale Data Center Operator

“Konlida's high-rebound conductive foam eliminated cavity-resonance peaks in our accelerator server, reducing EMI by 20dB from 2–8GHz while maintaining full airflow efficiency.”