Why EMI Matters in NEV?
core interference sources
- High-voltage system: Battery packs (400V/800V), inverters, and DC-DC converters generate strong common-mode noise.
- High-frequency switching: SiC/GaN devices introduce wideband interference in the MHz to GHz range.
- Dense wiring: High- and low-voltage harnesses run in parallel, easily causing crosstalk; signal lines such as CAN, LIN, and Ethernet are highly sensitive.
- Metal body cavity effects: Can easily form resonances, amplifying interference in specific frequency bands.
Recommended Solution:
1) KLD-T45-0001 Conductive Foam Gasket
√ Silicone-based material, –40°C to +125°C thermal resilience, supporting battery-pack cycling requirements,
√ Shielding effectiveness ≥60 dB (1–10 GHz), efficiently seals enclosure joints;
√ Custom hourglass or D-shaped geometries available to fit complex flange profiles;
2) 3D-C09002 Conductive Aluminum Foil Tape
√ Provides localized shielding for high-voltage sampling harnesses;
√ Highly conformable adhesive layer eliminates bubbles and fits curved cable routes.
Recommended Solution:
1) SMD-G-KLD Series SMT Gasket (e.g., 6-9.5-8-R)
√ Direct SMT mounting on PCB grounding pads, replacing mechanical springs;
√ 260°C reflow compatible, fully supports automated SMT production;
√ Z-axis resistance lower than 0.1 Ω, ensuring a low-impedance grounding path;
√ Ideal for grounding near driver ICs, gate drivers, and CAN transceivers;
2) AIR LOOP™ Conductive Foam Gasket
√ Apple-validated lightweight architecture reducing weight by ~30%;
√ Embedded signal-path design enables integrated "shielding + routing," ideal for compact integrated e-drive units.
Recommended Solution:
1) KLD-M33-0001 High-Resilience Conductive Foam
√ Surface resistance ≤0.07 Ω/sq; shielding ≥60 dB (10 MHz–3 GHz);
√ Used for sealing and shielding gaps in central displays, T-Box modules, and mmWave radar housings
2) Gold-Plated PI Film SMT Foam (e.g., SMD-G-KLD-3-3-2-R)
√ Gold-plated surface provides long-term oxidation resistance and stable contact impedance;
√ Suitable for high-reliability grounding in connectors and RF modules.
Why Konlida for Automotive?
Trust Built on Proven Capability
To date, Konlida’s EMI shielding solutions are deployed across leading global industries:
🔹 Consumer Electronics: Integrated into flagship devices from Apple, Huawei, Xiaomi, OPPO, and other top brands.
🔹 New Energy Vehicles: Trusted within the supply chains of BYD, NIO, XPeng, Bosch, UAES, and major Tier-1 partners.
🔹 Telecom & Industrial Equipment: Applied in critical systems from Huawei, ZTE, HPE, Siemens, and GE Healthcare.
We are more than a materials supplier—we are your EMC engineering partner, delivering innovation, reliability, and close technical collaboration to solve your most demanding electromagnetic compatibility challenges.
Please feel free to reach out to us with any questions, comments, or concerns. You can contact our customer support team at phone number or email address. We are here to assist you in any way we can. Thank you for choosing to connect with us.
● Perfect solution
● Material selection
● Process implementation
● Complete test data
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