Solutions | Solutions Information & Advice

Why EMI Matters in NEV

core interference source

High-voltage system: Battery packs (400V/800V), inverters, and DC-DC converters generate strong common-mode noise.
High-frequency switching: SiC/GaN devices introduce wideband interference in the MHz to GHz range.
Dense wiring: High- and low-voltage harnesses run in parallel, easily causing crosstalk; signal lines such as CAN, LIN, and Ethernet are highly sensitive.
Metal body cavity effects: Can easily form resonances, amplifying interference in specific frequency bands.

Severity of consequences

Control unit malfunction → Safety risk
Communication failure → Functional failure
Unable to pass vehicle EMC testing → Project delay, skyrocketing costs

Battery Management System (BMS) & Battery Pack

Pain points: high-voltage sampling line interference, inter-module coupling, enclosure gap leakage

Recommended Solution:
KLD-T45-0001 Conductive Foam Gasket
Silicone base material, temperature resistant from -40°C to 125°C, meets battery pack thermal cycling requirements
Shielding effectiveness ≥60dB (1–10 GHz), effectively blocks housing seams
Customizable hourglass and D-shaped structures, compatible with complex flange surfaces
3D-C09002 Conductive Aluminum Foil Tape
Wraps high-voltage sampling harnesses for local shielding
Highly conformable, adheres to curved surfaces without bubbles

Motor Controller (MCU) & On-Board Charger (OBC)

Pain points: IGBT/SiC switching noise, busbar radiation, PCB-level interference

Recommended Solution:
SMD-G-KLD Series SMT Conductive Foam (e.g., 6-9.5-8-R)
Directly SMT-mounted on PCB ground pads, replacing traditional springs
Reflow soldering temperature 260°C, supports automated production
Z-axis resistance

Smart Cockpit & ADAS Sensors

Pain points: 5G/V2X antenna interference, decreased millimeter-wave radar sensitivity, display EMI noise

Recommended Solution:
KLD-M33-0001 High Resilience Conductive Foam
Surface resistance ≤0.07 Ω/sq, shielding effectiveness ≥60dB (10MHz–3GHz)
Used for sealing gaps inside the central control screen, T-Box, and millimeter-wave radar cover
Gold-plated PI film SMT foam (e.g., SMD-G-KLD-3-3-2-R)
Gold surface is anti-oxidation, with stable contact impedance over long-term use
Suitable for high-reliability connector grounding

Why Konlida for Automotive?

Automotive-Grade Material System

All EMI shielding materials are certified to UL94 V-0 / V-1 flammability standards, meeting the stringent fire safety requirements of new energy vehicles.

Global Environmental Compliance

Fully compliant with RoHS, REACH, and Halogen-Free regulations, ensuring seamless market access to Europe, North America, Japan, Korea, and other high-end regions.

Wide-Temperature Stability

Materials reliably operate in extreme environments from –40°C to +125°C, with select silicone-based products rated up to +150°C, ideal for high-heat applications such as inverters and OBCs.

Automotive Reliability Validation

Critical materials have passed key AEC-Q200-related tests, including thermal shock, humidity aging, and vibration fatigue, supporting customers’ vehicle-level EMC and functional safety development.

Multiple Core Material Options

Offering four primary foam substrates—PU, PORON®, Silicone, and EPDM—to precisely match varying compression force (10–80 psi), resilience, and sealing requirements.

Precision Forming for Complex Geometries

Supported by waterjet cutting, CNC machining, and die-cutting, enabling custom cross-sections such as D-shape, hourglass, and multi-step profiles for irregular mounting surfaces.

Integrated Functional Design

Customizable features include adhesive types (acrylic/silicone) and multi-layer laminates (e.g., conductive fabric + foam + aluminum foil), delivering combined EMI shielding, grounding, cushioning, and insulation in a single component.

Early-Stage Engineering Collaboration

Dedicated FAE teams engage during the design phase to provide DFM (Design for Manufacturability) reviews, 3D model simulation support, and rapid prototyping—with samples delivered within 72 hours.

Scalable Supply Capacity

Our in-house manufacturing facility delivers over 5 million meters of conductive shielding materials annually, ensuring stable supply for high-volume automotive or consumer electronics programs.

End-to-End Quality Control

From raw material inspection (IQC) to final shipment (OQC), we adhere to the IATF 16949 quality management system, with full traceability of all critical parameters.

Exceptional Batch-to-Batch Consistency

Automated coating, lamination, and inspection systems guarantee consistent performance in key metrics—such as shielding effectiveness, thickness tolerance, and contact resistance—with CPK ≥ 1.33.

Validated by Industry Leaders

Successfully qualified in the supply chains of top-tier OEMs and Tier 1 suppliers, including BYD, NIO, Bosch, and UAES, demonstrating proven capability in automotive-grade volume production.

Trust Built on Proven Capability

To date, Konlida’s EMI

shielding

solutions

have been widely adopted across leading global

industries

🔹 Consumer Electronics: Flagship devices from Apple, Huawei, Xiaomi, OPPO, and more
🔹 New Energy Vehicles: Supply chains of BYD, NIO, XPeng, Bosch, UAES, and other Tier 1 partners
🔹 Telecom & Industrial Equipment: Critical systems from Huawei, ZTE, HPE, Siemens, and GE Healthcare

We are not just a

materials

supplier—we are your trusted EMC engineering partner, committed to solving your toughest electromagnetic compatibility

challenges

with innovation, reliability, and collaboration.

Message Form

GET IN TOUCH WITH US

Please feel free to reach out to us with any questions, comments, or concerns. You can contact our customer support team at phone number or email address. We are here to assist you in any way we can. Thank you for choosing to connect with us.

We can provide you with

● Perfect solution

● Material selection

● Process implementation

● Complete test data