Aerospace-Grade EMI Shielding Solutions

Why EMI Matters in Aerospace

Challenge	Requirement
Extreme Temperatures	Operation from –55°C to +125°C (or higher)
Vacuum & Low Outgassing	Must pass ASTM E595 (TML <1.0%, CVCM <0.1%)
Vibration & Shock	Maintain shielding integrity under 20G+ mechanical stress
Long Service Life	No degradation over 15–30 years in sealed avionics bays
Strict EMC Standards	Compliance with RTCA DO-160 Section 20, MIL-STD-461G, EUROCAE ED-14

🔍 Common searches: “DO-160 EMI gasket”, “low outgassing conductive foam aerospace”, “EMI shielding for UAV avionics”

Konlida Aerospace EMI Solutions

Avionics & Flight Control Systems

Application:

Radar modules, FMS, inertial navigation units

Solutions:

Silicone-Based Conductive Elastomer Gaskets:

Temp range: –60°C to +200°C
Shielding: >90 dB (100 MHz – 10 GHz)
Flame resistance: FAR 25.853 / UL 94 V-0

Metal-Filled Conductive Tapes:

For EMI sealing of access panels

Unmanned Aerial Vehicles

Application:

RF datalinks, EO/IR payloads, autopilot PCBs

Solutions:

Lightweight Conductive Foam：

Density less than 0.4 g/cm³ — reduces payload weight ；
Low magnetic permeability — avoids compass deviation
Compatible with carbon fiber composite housings

Flexible EMI Shielding Films：

Conformable to curved UAV fuselages

Satellites & Space Systems

Application:

Star trackers, S-band transceivers, power distribution units

Solutions:

Multi-Layer EMI/RFI Absorbers：

Suppress cavity resonances in compact satellite buses

Cabin Electronics & IFE Systems

Application:

In-flight entertainment, passenger Wi-Fi, seat electronics

Solutions:

Halogen-Free, Low-Smoke Conductive Foams：

Meets FAA smoke density & toxicity requirements；
RoHS & REACH compliant；
Easy integration into modular cabin architectures

Avionics & Flight Control Systems

Unmanned Aerial Vehicles (UAVs / Drones)

Application :

Radar modules, FMS, inertial navigation units

Solutions:

Application :

RF datalinks, EO/IR payloads, autopilot PCBs

Solutions:

Silicone Conductive Elastomer Gaskets

Metal-Filled Conductive Tapes

Temp range: –60°C to +200°C ；Shielding: >90 dB (100 MHz – 10 GHz) ；Flame resistance: FAR 25.853 / UL 94 V-0

For EMI sealing of access panels

Lightweight Conductive Foam

Flexible EMI Shielding Films

Density <0.4 g/cm³ — reduces payload weight ； Low magnetic permeability — avoids compass deviation ； Compatible with carbon fiber composite housings

Conformable to curved UAV fuselages

Cabin Electronics & IFE Systems

Application :

Star trackers, S-band transceivers, power distribution units

Solutions:

Application :

In-flight entertainment, passenger Wi-Fi, seat electronics

Solutions:

Multi-Layer EMI/RFI Absorbers

Suppress cavity resonances in compact satellite buses

Halogen-Free, Low-Smoke Conductive Foams

Meets FAA smoke density & toxicity requirements； RoHS & REACH compliant； Easy integration into modular cabin architectures

Why choose Konlida?

Technical Advantages Aligned with Communication Needs

Ultra-Wideband Shielding

60–90 dB from 30 MHz to 10 GHz

Thermal Stability

Materials stable under 7x24 operation in data centers

Automation Ready

SMT gasket supports high-speed pick-and-place assembly

Global Compliance

Meets FCC Part 15, CE RED, Telcordia GR-1089

Proven in Real Deployments

Global Optical Module Manufacturer

“Konlida's SMT gasket reduced EMI noise by 18dB in our 800G OSFP module, enabling first-pass compliance with IEEE 802.3df.”

Top 3 Telecom Infrastructure Provider

“Their silicone gasket solved persistent leakage at the 5G AAU cover joint, even after 1,000 thermal cycles.”

Leading Hyperscale Data Center Operator

“Konlida's high-rebound conductive foam eliminated cavity-resonance peaks in our accelerator server, reducing EMI by 20dB from 2–8GHz while maintaining full airflow efficiency.”

Proven in Real Deployments

Global Optical Module Manufacturer

“Konlida's SMT gasket reduced EMI noise by 18dB in our 800G OSFP module, enabling first-pass compliance with IEEE 802.3df.”

Top 3 Telecom Infrastructure Provider

“Their silicone gasket solved persistent leakage at the 5G AAU cover joint, even after 1,000 thermal cycles.”

Leading Hyperscale Data Center Operator

“Konlida's high-rebound conductive foam eliminated cavity-resonance peaks in our accelerator server, reducing EMI by 20dB from 2–8GHz while maintaining full airflow efficiency.”