SMT Conductive Foam Gasket consists of a highly elastic silicone core encased in a surface-coated conductive metal PET or PI. This SMT conductive foam provides a reliable grounding point on printed circuit boards, offering a new type of solderable conductive foam.

We hold relevant patents and intellectual property, and possess a complete production line. Our capabilities extend from design and validation to prototyping and mass production, enabling us to meet client requirements with high speed and efficiency.

The innovative LOOP design of the Air Loop Conductive Foam Gasket revolutionizes the traditional application of conductive foam, offering superior performance while achieving weight and thickness reduction. The internal LOOP structure allows for circuit connections and is now featured in most of Apple's product lines.

Fabric over Foam Gasket is typically a wrap-around foam consisting of conductive fabric or conductive PI (polyimide) encasing sponge or PORON. Its primary feature is its excellent surface conductivity, allowing it to be easily secured with adhesive tape onto shielded components. The products are distinguished by their superior performance and stable structure.

The all-directional conductive foam is produced using advanced polymer composite foam technology, resulting in uniform cell size, softness, elasticity, and non-shedding properties. This foam evenly distributes to protect device pins and exhibits corrosion resistance, making it an ideal material for long-term device storage. Our latest research and development have produced all-directional conductive foam that can withstand temperatures up to 200°C.

Beryllium Copper Finger Stock is made from beryllium copper alloy and is used as shielding covers to seal gaps between two contact surfaces, providing high EMI shielding effectiveness. Beryllium copper is primarily utilized in various high-performance elastic components, especially where good conductivity, corrosion resistance, abrasion resistance, cold resistance, and non-magnetic properties are required. It is widely used in membrane switches, diaphragms, bellows, and micro switches.

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