As electronic devices become more compact and operate at increasingly higher frequencies, electromagnetic interference (EMI) has emerged as a hidden but critical challenge. Often described as “electromagnetic noise pollution,” EMI can cause signal distortion, degraded performance, system instability, or even data loss.
EMI shielding gaskets are one of the most effective defenses against this problem. They create a continuous conductive path across enclosure seams, preventing unwanted electromagnetic energy from escaping or entering sensitive circuits. In the 5G era—where higher power levels, wider frequency bands, and ultra-thin designs dominate—EMI gaskets are facing unprecedented performance demands.
An EMI shielding gasket is a conductive and elastic interface component installed between two mating surfaces, typically metal enclosures or frames. Its primary function is to eliminate discontinuities at seams by maintaining low contact resistance under compression.
A properly designed EMI gasket enables:
Containment of internal EMI emissions, reducing radiated interference
Blocking of external electromagnetic noise, improving immunity (EMS)
Ground continuity, providing a reliable discharge path for ESD
From a physical perspective, EMI shielding gaskets work through a combination of reflection loss at the conductive surface and absorption loss caused by eddy currents inside the conductive structure. High-performance gaskets must maintain stable electrical conductivity and conformability throughout their specified compression range.
For a deeper understanding of interface impedance control in EMI gaskets, see
EMC Gasket: Interface Impedance Control for High-Frequency Noise Suppression.
Compared with previous generations, 5G electronics introduce higher RF power, denser integration, and thinner mechanical structures. These trends translate directly into stricter requirements for EMI shielding gaskets:
At millimeter-wave frequencies, even minor impedance discontinuities can cause severe signal reflection and loss. EMI gaskets must deliver excellent conductivity at thicknesses as low as 0.1 mm.
5G spans from Sub-6 GHz to mmWave bands, requiring consistent shielding effectiveness (SE) across a wide frequency spectrum.
Thin housings and sensitive assemblies demand effective shielding at low compression ratios (typically 10–30%) while generating minimal closing force to avoid deformation of displays or frames.
EMI gaskets must withstand vibration, thermal cycling, humidity, and aging without degradation in electrical or mechanical performance.
Backed by more than a decade of material engineering and application experience, Konlida Precision Electronics offers a comprehensive range of EMI shielding gasket solutions tailored to modern electronics.
These are among the most widely used and cost-effective EMI gaskets, consisting of PU, silicone, or CR foam cores wrapped with conductive fabric or conductive PI film.
Key advantages:
Excellent conformability and cushioning
Customizable profiles (rectangular, D-shape, P-shape, etc.)
Reliable EMI shielding and environmental sealing
As a long-term supplier for flagship consumer electronics programs, Konlida delivers ultra-thin conductive foam gaskets down to 0.1 mm, with dimensional tolerances of ±0.1 mm.
For a detailed performance analysis, refer to
Fabric over Foam Gaskets: Resistivity, Shielding Effectiveness, and Compression Performance.
AIR LOOP gaskets feature a hollow tubular structure, engineered for applications requiring ultra-low compression force and minimal thickness.
Structural benefits:
Compression force reduced to 20–30% of solid foam designs
Lower weight and thinner stack-up
More uniform contact across uneven mating surfaces
Typical applications include large-display assemblies such as tablets and laptops, where conventional gaskets may introduce excessive mechanical stress.
Designed for direct PCB grounding and shielding, SMT gaskets can be mounted using standard reflow soldering processes.
Advantages include:
Full compatibility with automated assembly lines
Strong, reliable solder joints (reflow temperatures up to 280 °C)
Excellent rebound to absorb vibration and mechanical shock
Konlida provides multiple SMT gasket structures, from silicone-core wrapped foams to extruded conductive silicone, widely applied in smartphones, TVs, and automotive electronics.
Learn more about automation-ready solutions here:
SMT Gaskets: High-Precision EMI Shielding and Automation-Ready Solutions.
These gaskets are made from fully conductive foam with isotropic conductivity.
Key features:
Flexible cutting and die-forming
Cost-efficient EMI sealing
Good corrosion resistance and shock absorption
They are commonly used around camera modules, connectors, and localized shielding zones inside enclosures.
Choosing the optimal EMI shielding gasket requires a system-level evaluation:
Shielding effectiveness (SE): Target frequency range and required dB attenuation
Mechanical constraints: Available gap, compression range, and allowable closing force
Environmental conditions: Temperature, humidity, chemicals, and flame retardancy (UL94)
Mounting method: Adhesive-backed, mechanical retention, or SMT soldering
Cost-performance balance: Optimized for both reliability and total cost of ownership
Konlida’s core strength lies not only in supplying standard EMI gaskets, but in delivering customized, application-driven solutions. Leveraging advanced materials, electromagnetic simulation (ANSYS), prototype validation, and scalable manufacturing, Konlida supports customers from concept to mass production.
In the increasingly complex electromagnetic environment of 5G electronics, EMI shielding gaskets are no longer optional—they are essential to product reliability and EMC compliance. Selecting the right gasket solution is an investment in long-term performance and brand quality.
With advanced materials, proven engineering expertise, and a deep understanding of real-world applications, Konlida Precision Electronics stands ready to be your trusted EMC and EMI shielding partner.
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