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SMT Gaskets: High-Precision EMI Shielding and Automation-Ready Solution

Core Value of SMT Gaskets

In modern electronics manufacturing, SMT gaskets (Surface Mount Technology conductive foam) are increasingly replacing manual assembly, becoming a critical EMI shielding material in high-frequency devices, automotive electronics, and industrial modules. Their value lies in three core aspects:

  1. Miniaturization and High-Precision Compatibility

  • Thickness range: 0.25–3.0mm ultra-thin design, optimized for mmWave communication.

  • Tolerance control: ±0.05mm precision (ASTM D3574), meeting the requirements of high-speed SMT machines.

  • Application scenarios: 5G base stations, automotive cameras, and industrial sensors.

  1. Low Impedance and High-Frequency Stability

  • Surface resistance: ≤0.1Ω/sq (Ag-Cu / Nano-Ag coating) for efficient grounding.

  • Shielding effectiveness: 65–80dB (1–6GHz), minimizing signal reflection and interference.

  • Closed-cell structure: Enhances EMI absorption paths, improving high-frequency stability.

👉 For EMI shielding test standards, see Full Manufacturing Process of Conductive Shielding Foam: From Substrate Selection to Final Delivery.

Maintainable conductive foam shielding structure diagram; Konlida EMI sealing solution; Non-adhesive conductive foam illustration.


Process Innovation in SMT Gaskets

The process chain of SMT gaskets integrates material selection with SMT-optimized structural design. Key innovations include:

  • Material & coating pairing: Silicone, EPDM, or PU substrates matched with Ni-Cu, Ag-Cu, or Nano-Ag coatings.

  • SMT molding technology: Laser die-cutting achieves 0.1mm precision, with tape-and-reel packaging for SMT machines.

  • Adhesive integration: Acrylic or hot-melt adhesives enhance mounting reliability.


Typical Applications and Solutions

With miniaturization, precision, and automation-ready compatibility, SMT gaskets are widely applied in:

  • High-frequency communication devices: Ultra-thin PU + Nano-Ag coating for mmWave systems.

  • Automotive electronics modules: Silicone + Ag-Cu coating, meeting IP67 protection standards.

  • Industrial sensor interfaces: EPDM + Ni-Cu coating, die-cut into complex contours.

Metal-coated conductive foam diagram; Ni-Cu coated foam illustration; Konlida metallic conductive foam structure.


Konlida’s Advantages in SMT Gaskets

Konlida offers end-to-end SMT gasket solutions, covering the full cycle from design to production:

  1. Rapid Prototyping and Mass Production

  • 72-hour prototyping: Based on drawings or reverse engineering.

  • ISO 9001 certified lines: Ensuring batch consistency.

  • JIT delivery: Demand-driven production, reducing inventory costs.

  1. Flexible Customization Services

  • Complex shapes: Wavy, serrated, and irregular outlines.

  • Multi-layer composites: Conductive + insulating + adhesive integration.

  • Advanced coatings: Nano-silver, Ag-Cu, and other high-performance options.

  1. Environmental and Compliance Certifications

  • RoHS/REACH certified: Halogen-free, low VOC.

  • UL 94V-0 flame rating: Reliable for high-temperature environments.

  • Salt spray test: 500 hours of corrosion resistance for outdoor applications.

👉 For related insights, see How to Select the Right Type of Conductive Shielding Foam for Your Application?.


Future Outlook of SMT Gaskets

As electronic devices evolve toward higher frequencies, smaller dimensions, and greater integration, SMT gaskets will remain a mainstream EMI shielding choice. With ongoing R&D investment, Konlida is committed to delivering reliable, automation-compatible, and precision-engineered gasket solutions that ensure stable device performance in demanding environments.

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Full Manufacturing Process of Conductive Shielding Foam: From Substrate Selection to Final Delivery
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