EMI Shielding Insights: Trends, Tech & Compliance

2026 Consumer Electronics Trends: Solving EMI and Thermal Challenges

Discover key 2026 consumer electronics trends and how Konlida solves EMI shielding and thermal management challenges in ultra-thin, highly integrated, and 5G-enabled devices with advanced SMT gaskets and custom materials.

2026 01 08

Hidden EMI Traps in Consumer Electronics: Why SMT Gaskets Fail During Mass Production

Unstable signals, EMI failures, and costly redesigns often trace back to SMT gasket design errors. Learn the top PCB, compression, and placement mistakes—and how SMT gaskets ensure reliable grounding in consumer electronics.

2026 01 05

Why Do Phones and Tablets Keep Losing Signal or Wi-Fi?

Frequent signal drops in smartphones and tablets are often caused by grounding failure—not antennas. This article explains the EMI root causes and shows how SMT conductive foam ensures stable grounding for 5G and Wi-Fi 6E devices.

2025 12 29

Custom Conductive Foam Solutions: From Concept to Mass Production

When standard EMI gaskets fall short, custom conductive foam becomes essential. This guide explains Konlida's end-to-end customization process—from requirements definition and material formulation to tooling, validation, and mass production.

2025 12 24

Solving EV Battery EMI Challenges: Konlida's Shielding Breakthrough

As EV platforms move to high voltage and SiC power electronics, EMI risks escalate. Discover how Konlida delivers automotive-grade EMI shielding solutions for battery packs and control units—thin, durable, and production-ready.

2025 12 22

Breaking the 5G EMI Trade-Off: AIR LOOP Gasket for Thin Devices

As 5G devices get thinner and more complex, EMI shielding faces new limits. Discover how Konlida's AIR LOOP Gasket delivers high shielding effectiveness, reduced thickness, and lightweight design for smartphones, laptops, and automotive electronics.

2025 12 19

Conductive Foam Failure Analysis: From Root Causes to Permanent Solutions

This article analyzes common conductive foam failure modes in SMT soldering, long-term compression, and material interfaces, offering root-cause mechanisms and proven engineering solutions to improve EMI shielding reliability.

2025 12 15

Conductive Foam Manufacturer Evaluation: Data-Driven Analysis of Industry Leaders

A comprehensive, data-driven evaluation of global conductive foam manufacturers. This report compares core technology, vertical integration, EMI shielding performance, quality systems, and market validation to help engineers select the right supplier.

2025 12 12

Konlida: Trusted Leader in Conductive Foam & EMI Shielding Solutions

Konlida delivers advanced conductive foam, SMT Gasket, and EMI shielding solutions for consumer electronics, automotive, communication, and medical markets — combining 19 years of experience with full custom support and high reliability.

2025 12 10

SMT Gasket vs. Adhesive Conductive Foam: A Complete Engineering Comparison

Discover the engineering differences between SMT Gaskets and adhesive conductive foam. Learn how solder-bonded SMT Gaskets improve reliability, conductivity, automation efficiency, and space utilization in high-density electronics.

2025 12 08

Conductive Foam Applications: How Konlida Delivers Reliable EMI Solutions

An analysis of how Konlida's conductive foam solutions address EMI shielding & grounding challenges across consumer electronics, automotive, communications and medical devices. Includes SMT Gasket, Air Loop Gasket and full-stack customization.

2025 12 05

Why Leading Brands Choose Konlida as Their Conductive Foam Supplier

Konlida delivers high-performance SMT Gaskets and Air Loop Gaskets for advanced EMI shielding, grounding and automotive EMC applications. Discover why global brands trust Konlida for reliability, engineering capability and fast customization.

2025 12 03