Conductive Foam in New Energy Vehicles: Applications & Trends

With the rapid growth of the new energy vehicle (NEV) market, the complexity of in-vehicle electronic systems has increased significantly, leading to more severe electromagnetic interference (EMI) challenges. Thanks to its excellent shielding performance and compression resilience, conductive foam has become an essential material in NEV electronic systems.

1. Key Applications in NEVs

Conductive foam is widely used in:

• Battery pack shielding – Preventing electromagnetic interference between cells.

• BMS (Battery Management System) sealing & shielding – Ensuring stable battery operation.

• In-vehicle communication modules (e.g., 5G T-BOX) – Enhancing signal stability.

• High-voltage connectors & harness interfaces – Providing both sealing and conductivity.

• ADAS sensor housing – Protecting radar and camera modules from interference.

2. Material Selection & Requirements

NEVs demand materials with high durability, environmental compliance, and long-term stability. Key considerations include:

• Base material – Silicone, TPE, or EPDM for heat and aging resistance.

• Coating type – Water-based, graphene, or conductive polymer coatings to meet RoHS and REACH standards.

• Compression resilience – Maintaining sealing and shielding under vibration.

• Recyclability – Aligning with OEM green supply chain requirements.

3. Konlida's Advantages

Konlida conductive foam offers:

• High shielding effectiveness across low to high frequencies.

• Wide temperature tolerance: -40℃ to 150℃.

• Custom processing: die-cutting, adhesive backing, stamping, etc.

• Environmental compliance: RoHS & REACH certified.

• Proven automotive applications: Used by brands like BYD, NIO, and XPeng.

4. Future Development Trends

The demand for conductive foam in NEVs will follow three main directions:

1. Greener materials – Recyclable, low-VOC, and heavy-metal-free.

2. Lightweight design – Supporting vehicle range extension.

3. Smart integration – Combining with flexible electronics and AI sensing systems.