NEPCON China 2025 in Full Swing – Konlida Unveils Its New SMT Conductive Foam Gaskets!

2025-04-24

Exhibition Overview

On April 22, 2025, the global electronics manufacturing industry turns its spotlight on Shanghai as NEPCON CHINA 2025 (China International Electronic Production Equipment and Microelectronics Industry Exhibition) officially opens.

Suzhou Konlida Precision Electronics Co., Ltd., a leading provider of EMI shielding solutions, proudly presents its latest innovation – SMT Conductive Foam, injecting fresh momentum into the industry.

NEPCON China 2025 in Full Swing – Konlida Unveils Its New SMT Conductive Foam Gaskets! 2

PART 01 | Exhibition Highlights at a Glance

Launch of 5 SMT Conductive Foam Series

Konlida introduces five series of SMT Conductive Foam products, offering new options for EMI grounding. These foam components are reflow-solderable directly onto PCB boards and serve as highly elastic conductive contact terminals for EMI grounding or electrical connections.

NEPCON China 2025 in Full Swing – Konlida Unveils Its New SMT Conductive Foam Gaskets! 3

NEPCON China 2025 in Full Swing – Konlida Unveils Its New SMT Conductive Foam Gaskets! 4

SMT Conductive Foam Application Insights

Konlida’s SMT Conductive Foam is applicable across a wide range of industries and devices, including open cell displays, smartphones, cameras, TVs, laptops, and automotive electronics. In-depth discussions with clients on expanding potential application scenarios are taking place throughout the show.

NEPCON China 2025 in Full Swing – Konlida Unveils Its New SMT Conductive Foam Gaskets! 5

NEPCON China 2025 in Full Swing – Konlida Unveils Its New SMT Conductive Foam Gaskets! 6

Failure Cases & Solution Sharing

At the booth, Konlida shares expert insights on addressing industry pain points such as cold solder joints, component shift, compression set failure, and PI/metal layer fractures in SMT conductive foam. Our tailored solutions aim to enhance performance and reliability across demanding use cases.

NEPCON China 2025 in Full Swing – Konlida Unveils Its New SMT Conductive Foam Gaskets! 7

NEPCON China 2025 in Full Swing – Konlida Unveils Its New SMT Conductive Foam Gaskets! 8

NEPCON China 2025 in Full Swing – Konlida Unveils Its New SMT Conductive Foam Gaskets! 9

PART 02 | A Thriving Exhibition Scene

Fully Booked Meeting Area

Thanks to the efforts of the Konlida team, the booth has seen an overwhelming turnout, with the meeting area consistently filled. After on-site consultations and technical discussions, visitors gained deeper insights into Konlida's capabilities and expressed strong intentions for future collaboration.

NEPCON China 2025 in Full Swing – Konlida Unveils Its New SMT Conductive Foam Gaskets! 10

NEPCON China 2025 in Full Swing – Konlida Unveils Its New SMT Conductive Foam Gaskets! 11

Konlida remains committed to a customer-centric approach, continuously delivering high-quality products, solutions, and services to meet evolving industry needs.

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