High-Conductivity Silicone Thermal Pad

– 15W/mK, UL94 V-0

Konlida’s silicone thermal pad (e.g., AG03-016) delivers ≥15 W/m·K thermal conductivity, making it ideal for power electronics, 5G base stations, and other EMI-shielded assemblies requiring reliable heat transfer. This RoHS-compliant, UL94 V-0 rated material is manufactured in our IATF 16949-certified facility.

Why Use Silicone Thermal Pad in EMI Shielding

Electronic devices heat up because of Joule heating, a fundamental physical phenomenon: as current flows through a conductive material, electrons collide with atoms and generate heat due to electrical resistance.

Modern high-power components—like CPUs, GPUs, LEDs, and power converters—dissipate large amounts of thermal energy.

To maintain performance and reliability, systems use thermal management to keep temperature in check.

How It Works with Your EMI Shielding Solution

In integrated electronic assemblies, thermal management and electromagnetic interference (EMI) shielding must work together. Our silicone thermal pad is designed to complement your EMI shielding system by filling the critical thermal gap between heat-generating components and the metal shield or chassis.

The typical stack-up looks like this:

Heat-generating component (e.g., power IC, RF amplifier, voltage regulator)
Silicone thermal pad – fills air gaps, reduces thermal resistance, and maintains consistent contact pressure
Metal EMI shield or grounded chassis – provides electromagnetic shielding while acting as a heatsink

This configuration ensures that:

Heat is efficiently transferred away from sensitive components
The EMI shield remains in full contact with the PCB ground plane (no gaps that cause leakage)
Mechanical stress from thermal cycling is absorbed by the compressible pad, preserving gasket performance

This co-design approach is already deployed in 5G base stations, electric vehicle control units, and industrial power systems where both thermal stability and EMI compliance are non-negotiable.

Key Features of AG03-016 Silicone Thermal

High thermal conductivity silicone pad with ≥15 W/m·K performance
Soft silicone thermal pad (65 Shore A) for excellent conformability to uneven surfaces
UL94 V-0 silicone thermal pad – safe for high-voltage and enclosed applications
Wide operating temperature range: −50°C to +200°C
RoHS compliant thermal pad – meets global environmental and safety standards

When to Choose Silicone Thermal

Material	Best For	Limitations
Silicone Thermal Pad	Cost-sensitive, serviceable designs; moderate power density	May bleed oil over time in sealed systems
Non-Silicone (Acrylic) Pad	EV batteries, sealed optics – zero outgassing	Lower thermal conductivity (~2 W/mK)
Thermal Grease	Lowest thermal resistance	Messy, pump-out risk, not reworkable
Phase Change Material	High-performance servers	Requires precise melt temp control

Technical Specifications

Property	Value	Standard
Thermal Conductivity	≥15 W/m·K	ASTM D5470
Hardness	65 Shore A	ASTM D2240
Density	3.55 g/cm³	ASTM D792
Operating Temp	−50°C to +200°C	—
Dielectric Strength	≥10 kV/mm	ASTM D149
Flammability	UL94 V-0	UL 94
Volume Resistivity	≥1.0×10¹³ Ω·cm	GB/T 1410
Thickness Options	0.5, 1.0, 1.5, 2.0, 3.0 mm	—
Compliance	RoHS, REACH, Halogen-Free	IEC 62321

Why Choose Our Silicone Thermal

Engineers select our silicone thermal pad for power electronics because it maintains stable performance under thermal cycling. Its softness (65 Shore A) ensures low contact resistance even on rough PCB surfaces—critical in EMI shielding environments where air gaps cause both thermal hotspots and RF leakage.

The material is naturally tacky, requires no adhesive, and withstands long-term compression without significant set, ensuring consistent thermal conductivity.

Typical Applications

5G mmWave Base Stations

Place between PA/MMIC and

metal

EMI

shield

to prevent

thermal

throttling while maintaining >80 dB SE.

→ silicone thermal interface material for 5g

AI/GPU Server Power Delivery

VRM to cold plate under EMI can—ensures stable voltage under load without radiated emissions.

→ silicone thermal pad for server power supply

Automotive Radar & ECU

High dielectric strength prevents arcing in high-voltage

modules

inside

shielded

enclosures.

→ silicone thermal pad iatf 16949 certified

Silicone vs. Other Thermal Interface Materials

Material	Best For	Limitations
Silicone thermal pad (e.g., AG03-016)	Cost-effective, reworkable designs; silicone thermal pad for power electronics; moderate power density	May exhibit minimal oil migration in fully sealed systems
Non-silicone (acrylic) pad	EV batteries, optical cavities – zero outgassing required	Lower thermal conductivity (~2 W/m·K)
Thermal grease	Lowest thermal resistance in lab conditions	Pump-out risk, messy, not serviceable
Phase change material	High-performance computing	Requires precise reflow profile control

We offer Thermal Interface Materials designed to meet your manufacturing needs. Each has its own features adapted for different use cases.

Thermal Conductive Silicone

Thermally conductive silicone is a cost-effective thermal interface material that also provides excellent environmental sealing. It’s ideal when moderate thermal conductivity is needed—especially in applications where electrical isolation isn’t critical.

These silicones are available in a variety of formats: extruded profiles, jointed O-rings, large sheets (e.g., 380 mm × 508 mm), or precision die-cut shapes. For enhanced convenience, they can feature a proprietary ultra-thin pressure-sensitive adhesive (PSA) layer, minimizing impact on thermal conductivity.

With low thermal resistance under low compression, this material conforms well to uneven or high-tolerance surfaces while generating minimal rebound stress—reducing stress on delicate electronics during assembly. Ideal for filling variable gaps, it ensures reliable heat transfer without compromising mechanical integrity.

Graphite Sheet

A Graphite Sheet, also commonly known as a thermal flexible graphite sheet, is a high-performance thermal management material. Its primary function is to spread heat uniformly along its plane, effectively eliminating "hot spots" and protecting heat - sensitive components in various electronic devices.

Key Characteristics

Ultra-High Thermal Conductivity: In-plane conductivity ranges from ~150 to 1500 W/m·K, outperforming many metals.
Chemical & Thermal Stability: Made of high-purity carbon, it remains stable from –40 °C up to +400 °C and resists corrosion

Flexible & Conformable: Thin, bendable, and able to conform to flat or curved surfaces with ease.
Lightweight: Much lighter than traditional metal heat spreaders—about 25% lighter than aluminum and ~75% lighter than copper.

Anisotropic Thermal Conductive Composite Sheet

Key Characteristics

Low In-Plane Conductivity: Restricts lateral heat spreading, helping concentrate cooling on the hot zone and protect neighboring components.
High Anisotropy Ratio: The ratio of in-plane to through-plane conductivity defines effectiveness—higher ratios mean stronger directional control.

Anisotropic Thermal Conductive Composite Sheet

An anisotropic thermal conductive composite sheet is a TIM engineered to conduct heat primarily in one direction (through-plane, Z-axis), while limiting heat spreading in the in-plane (X & Y) directions. This design helps channel heat straight out of hot components—such as CPUs or power modules—into a heatsink, without allowing lateral heat to affect nearby sensitive parts.

High Through-Plane Conductivity: Delivers a fast thermal “path” from the heat source to the cooling structure—polymer-based versions range from ~3–20 W/m·K; fiber- or graphite-aligned composites can exceed 50 W/m·K.
Tailored Thermal Management: Ideal for densely packed electronics, 3D stacked chips, or power modules where vertical heat flow must be maximized without overheating the board.

Graphite Copper Mesh

Graphite-copper mesh is a hybrid composite that fuses a continuous copper mesh with graphite, combining copper’s excellent electrical conductivity with graphite’s lubricity and thermal stability to form a durable, high-performance material.

Key Characteristics & Benefits

Highly Conductive: The copper mesh provides a low-resistance path, enabling efficient current flow.
Self-Lubricating: Graphite acts as a solid lubricant, reducing friction and wear in sliding or moving contacts.
Wear-Resistant: The copper network and graphite together offer greater durability than graphite alone or other composites.
Thermally Efficient: Both copper and graphite help dissipate heat generated by friction or current.
Structurally Robust: The mesh structure ensures continuous mechanical and electrical integrity, improving performance over time.

Typical Uses

Ideal for flexible electronics, sensors, sliding contacts, and high-performance modules where reliable conductivity, wear resistance, and self-lubrication are essential.

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