| Challenge | Risk |
|---|---|
| High-Field MRI Environment | Magnetic materials cause image artifacts or device displacement (projectile risk) |
| Patient-Contact Components | Materials must pass ISO 10993 biocompatibility testing |
| Portable / Wearable Devices | Ultra-thin design limits shielding space, yet must meet FCC/CE EMC requirements |
| High-Density Electronics in Surgical Robots | EMI causes control latency or unintended movements |
| External Circuits of Long-Term Implantable Devices | Materials must not release harmful substances (low extractables, low outgassing) |
“Konlida's SMT gasket reduced EMI noise by 18dB in our 800G OSFP module, enabling first-pass compliance with IEEE 802.3df.”
“Konlida's high-rebound conductive foam eliminated cavity-resonance peaks in our accelerator server, reducing EMI by 20dB from 2–8GHz while maintaining full airflow efficiency.”
“Konlida's SMT gasket reduced EMI noise by 18dB in our 800G OSFP module, enabling first-pass compliance with IEEE 802.3df.”
“Konlida's high-rebound conductive foam eliminated cavity-resonance peaks in our accelerator server, reducing EMI by 20dB from 2–8GHz while maintaining full airflow efficiency.”
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