Conductive particles or metallized fibers—such as silver, nickel, copper, or graphite—are embedded in the polymer matrix of the tape. These form conductive pathways that allow small currents (typically in the milliamp range) to flow between substrates. Variations in filler type and structure directly affect resistivity and performance of the tape.
Unlike soldering or mechanical clips, conductive tapes bond reliably at low temperatures—ideal for heat-sensitive components. Their flexible structure absorbs vibration and stress better than rigid connections, enhancing durability. They also allow clean, slim design without screws or clips, and can be easily die-cut or applied by hand or machine for fast assembly.
Excellent EMI/RFI shielding
Available in multiple materials & thicknesses
Custom-cut and die-cut capable
Conductive or non-conductive adhesive options
Compatible with a wide range of substrates
Supports lightweight, low-profile assemblies
| Conductive Fabric Tape |
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| Materials | Conductive Fabric+Conductive Adhesive+Release Paper | |
| Thickness | 0.5mm (Customizable) | |
| Surface Resistance | ≤0.05Ω/inch² | |
| Adhesion Strength | ≥0.7kg/inch | |
| Holding Time | >12H | |
| Vertical Resistance | ≤0.03Ω/sq inch | |
| Working Temperature | 10-80℃ | |
| Shielding Efficiency | 70-85dB (10MHZ-3GHZ) | |
| Metal Foil Tape |
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| Materials | Copper/Nickel Foil+Conductive Adhesive+Release Paper | |
| Surface Resistance | ≤0.05Ω/inch² | |
| Tack | ≥1.5kgf/inch | |
| Shielding Efficiency | 70-85dB (10MHZ-3GHZ) | |
| Holding Time | >48H | |
| Thermal Conductivity | 380W/(m*k) | |
| Working Temperature | Short Time-20~120℃ Long Time-10~80℃ |
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| Polyimide Tape |
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| Materials | Cu+Ni+Au+Polyimide Film (+Conductive Adhesive) |
| Color | Golden |
| Coating Thickness | 2μm (Customizable) |
| PI Thickness | 25μm (Customizable) |
| Shielding Efficiency | 70-100db (10MHz-1GHz) |
| Surface Resistance | ≤0.006Ω/Sq |
| Working Temperature | -40 ~ 200℃ |
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