Electrically Conductive Tapes

What is Electrically Conductive Tapes?

Electrically conductive tape is a pressure-sensitive adhesive product engineered to provide electrical continuity through its backing, adhesive layer, or both. It offers a flexible, low-profile solution for establishing grounding paths or shielding sensitive components against EMI and RFI.

Conductive Fabric Tape

Fabric-based backing (e.g., polyester or nylon) plated with metals such as nickel/copper and coated with conductive adhesive. It delivers high conductivity and shielding performance while remaining conformable to irregular surfaces—ideal for high-frequency EMI isolation in electronics like phones, computers and cable assemblies.

Conductive Metal-Foil Tape

Metal foil backing (such as aluminium or copper) combined with conductive adhesive. This tape is used for general EMI shielding and electrical connection tasks, and supports repairs, bonding and grounding in devices like smartphones, laptops, tablets and cameras.

Conductive PI Tape

Polyimide film backing with conductive coating and adhesive, offering high temperature resistance and thin-film form factor. This tape serves applications where minimal thickness and high reliability are critical, such as ultra-slim modules, flexible circuits and OEM grounding solutions.

How Electrically Conductive Tapes Work?

Conductive particles or metallized fibers—such as silver, nickel, copper, or graphite—are embedded in the polymer matrix of the tape. These form conductive pathways that allow small currents (typically in the milliamp range) to flow between substrates. Variations in filler type and structure directly affect resistivity and performance of the tape.

Advantages over Soldering and Fasteners

Unlike soldering or mechanical clips, conductive tapes bond reliably at low temperatures—ideal for heat-sensitive components. Their flexible structure absorbs vibration and stress better than rigid connections, enhancing durability. They also allow clean, slim design without screws or clips, and can be easily die-cut or applied by hand or machine for fast assembly.

Core Features & Benefits

Excellent EMI/RFI shielding

Available in multiple materials & thicknesses

Custom-cut and die-cut capable

Conductive or non-conductive adhesive options

Compatible with a wide range of substrates

Supports lightweight, low-profile assemblies

Applications

Temporary gap sealing for EMC testing
PCB shielding strips and component bonding
Cable harness and wire bundle shielding
Shielded enclosure seams and panel joints
Custom die-cut grounding pads and masks
Device chassis grounding and static discharge protection

Specifications/Data

Conductive Fabric Tape

Materials		Conductive Fabric+Conductive Adhesive+Release Paper
Thickness		0.5mm (Customizable)
Surface Resistance		≤0.05Ω/inch²
Adhesion Strength		≥0.7kg/inch
Holding Time		>12H
Vertical Resistance		≤0.03Ω/sq inch
Working Temperature		10-80℃
Shielding Efficiency		70-85dB (10MHZ-3GHZ)

Metal Foil Tape

Materials		Copper/Nickel Foil+Conductive Adhesive+Release Paper
Surface Resistance		≤0.05Ω/inch²
Tack		≥1.5kgf/inch
Shielding Efficiency		70-85dB (10MHZ-3GHZ)
Holding Time		>48H
Thermal Conductivity		380W/(m*k)
Working Temperature		Short Time-20~120℃ Long Time-10~80℃

Polyimide Tape

Materials	Cu+Ni+Au+Polyimide Film (+Conductive Adhesive)
Color	Golden
Coating Thickness	2μm (Customizable)
PI Thickness	25μm (Customizable)
Shielding Efficiency	70-100db (10MHz-1GHz)
Surface Resistance	≤0.006Ω/Sq
Working Temperature	-40 ~ 200℃

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