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石墨泡沫墊片


石墨泡沫墊片

概述

石墨泡沫墊片是一種導熱的電磁幹擾屏蔽墊片,它將柔性泡沫芯與外層合成石墨層結合在一起。
它提供可靠的 EMI 接地和平面散熱,同時保持低壓縮力、優異的彈性和輕巧的結構——非常適合高頻、高功率密度電子組件。


Omnidirectional Conductive Foam Gasket

Overview

The Omnidirectional Conductive Foam Gasket offers full three-axis (X, Y, Z) conductive contact and shielding within a compressible foam core wrapped in metallized fabric or foil. It is designed to handle complex geometries and high-density electronics, delivering superior EMI performance in enclosure seams, connector interfaces, and compact modules.
核心功能與優勢
雙重功能:單一墊片即可實現電磁幹擾屏蔽和導熱
低壓縮力:保護精密外殼和超薄外殼
Excellent rebound & fatigue resistance: Stable performance over repeated compression cycles
高面內導熱係數:高效率的界面熱擴散
輕薄設計:支援緊湊型和高密度佈局
耐磨石墨表面:在組裝和服務過程中保持導電性
大批量生產能力:相容模切和自動化組裝
UL94 V-0阻燃等級及環保合規性:符合RoHS及REACH要求
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Core Features & Benefits
Three-axis Conductivity — Provides electrical contact and grounding in all directions, ideal for fine-pitch and high-speed designs.
Low Compression Force — Engineered to establish reliable contact with minimal force and accommodate tolerant assemblies.
High Shielding Effectiveness — Achieves > 90 dB attenuation across broad frequencies in compact form factors.
Durable Construction — Metallized fabric resists abrasion, shear, and repeated closure cycles, ensuring long-term reliability.
Customizable Profiles — Available in die-cut shapes, slit strips, adhesive-backed formats and designed for odd-shaped or space-constrained applications.
Compliance — Flame-retardant, halogen-free, and RoHS-/REACH-compliant options available for rigorous regulatory environments.
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Structure Diagram
特性範圍
顏色黑色的
工作溫度-40~125℃
建議壓縮範圍25%
屏蔽效能75分貝
Z軸電阻0.009Ω
方面可客製化
符合ROHS標準是的
UL阻燃等級UL 94 V0
Structure Diagram
Color Silver Gray / Black
Shape Square Type, Strip Type, Rectangle Type or Customized as Required
Size Available in Various Thicknesses (Min: 0.2mm)
Materials Conductive Fabric, Open-cell Foam, Conductive PSA Tape
Structure Conductive Non-woven (optional) + Conductive Metallized Foam + Conductive Fabric / Mesh + Double-sided Conductive PSA + Release Paper


典型應用

新能源汽車電子
BMS外殼EMI密封墊片、OBC/DC-DC轉換器密封、高壓連接器屏蔽、逆變器外殼間隙填充
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通訊與數據基礎設施
光模組EMI隔熱墊片 5G AAU/RRU機箱密封 伺服器和AI機箱EMI控制
消費性電子和工業電子
行動裝置外殼密封墊片、工業控制器電磁幹擾密封、醫療設備電磁幹擾熱接口
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為什麼選擇石墨墊片而不是泡沫墊片?

提供可靠的電磁幹擾接地,同時有效率地將熱量透過介面傳遞。
即使經過反覆壓縮,泡棉芯材也能確保與基材保持穩定接觸,並將負載降至最低。
與金屬屏蔽方案相比,可實現更薄、更輕的設計。
易於模切、自動化,並可整合到大批量、高可靠性的應用中。
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專家風俗解決方案為了更有效率的電磁屏蔽成分
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