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石墨泡沫垫片


石墨泡沫垫片

概述

石墨泡沫垫片是一种导热的电磁干扰屏蔽垫片,它将柔性泡沫芯与外层合成石墨层结合在一起。
它提供可靠的 EMI 接地和平面散热,同时保持低压缩力、优异的弹性和轻巧的结构——非常适合高频、高功率密度电子组件。


Omnidirectional Conductive Foam Gasket

Overview

The Omnidirectional Conductive Foam Gasket offers full three-axis (X, Y, Z) conductive contact and shielding within a compressible foam core wrapped in metallized fabric or foil. It is designed to handle complex geometries and high-density electronics, delivering superior EMI performance in enclosure seams, connector interfaces, and compact modules.
核心功能与优势
双重功能:单个垫片即可实现电磁干扰屏蔽和导热
低压缩力:保护精密外壳和超薄外壳
优异的回弹性和抗疲劳性:在反复压缩循环中性能稳定
高面内导热系数:高效的热量跨界面扩散
轻薄设计:支持紧凑型和高密度布局
耐磨石墨表面:在组装和服务过程中保持导电性
大批量生产能力:兼容模切和自动化组装
UL94 V-0阻燃等级及环保合规性:符合RoHS和REACH要求
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Core Features & Benefits
Three-axis Conductivity — Provides electrical contact and grounding in all directions, ideal for fine-pitch and high-speed designs.
Low Compression Force — Engineered to establish reliable contact with minimal force and accommodate tolerant assemblies.
High Shielding Effectiveness — Achieves > 90 dB attenuation across broad frequencies in compact form factors.
Durable Construction — Metallized fabric resists abrasion, shear, and repeated closure cycles, ensuring long-term reliability.
Customizable Profiles — Available in die-cut shapes, slit strips, adhesive-backed formats and designed for odd-shaped or space-constrained applications.
Compliance — Flame-retardant, halogen-free, and RoHS-/REACH-compliant options available for rigorous regulatory environments.
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Structure Diagram
特性范围
颜色黑色的
工作温度-40~125℃
推荐压缩范围25%
屏蔽效能75分贝
Z轴电阻0.009Ω
方面可定制
符合ROHS标准是的
UL阻燃等级UL 94 V0
Structure Diagram
Color Silver Gray / Black
Shape Square Type, Strip Type, Rectangle Type or Customized as Required
Size Available in Various Thicknesses (Min: 0.2mm)
Materials Conductive Fabric, Open-cell Foam, Conductive PSA Tape
Structure Conductive Non-woven (optional) + Conductive Metallized Foam + Conductive Fabric / Mesh + Double-sided Conductive PSA + Release Paper


典型应用

新能源汽车电子
BMS外壳EMI密封垫片、OBC/DC-DC转换器密封、高压连接器屏蔽、逆变器外壳间隙填充
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通信与数据基础设施
光模块EMI隔热垫片 5G AAU/RRU机箱密封 服务器和AI机箱EMI控制
消费电子和工业电子
移动设备外壳密封垫片、工业控制器电磁干扰密封、医疗设备电磁干扰热接口
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为什么选择石墨垫片而不是泡沫垫片?

提供可靠的电磁干扰接地,同时高效地将热量通过接口传递。
即使经过反复压缩,泡沫芯材也能确保与基材保持稳定接触,并将负载降至最低。
与金属屏蔽方案相比,可实现更薄、更轻的设计。
易于模切、自动化,并可集成到大批量、高可靠性的应用中。
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更高效的电磁屏蔽解决方案定制专家

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