Comprehensive Guide to Electromagnetic Shielding and Thermal Management Materials: Principles, Selection, and Applications
This guide covers seven core materials—conductive fabric, conductive tape, conductive PI film, metal foil, microwave absorbers, thermal interface materials, and thermal insulation. It summarizes how they work, how to choose them, and where they are used, helping you quickly identify the right solution for 5G devices, automotive electronics, consumer products, and more.
Why It Matters
5G pushes devices toward higher frequencies and smaller sizes, making EMI control and heat dissipation more critical. Robust shielding and thermal materials ensure stable performance and prevent failures under demanding conditions.
Material Expertise
19+ years specializing in EMI shielding and thermal management materials.
Certified Quality
ISO/IATF systems and patented material technologies ensure reliable performance.
Customized & Scalable
Fast prototyping and flexible production for tailored material solutions.
Have you encountered the following problems in your design process?
- My equipment keeps failing EMC tests. How should I choose electromagnetic shielding materials?
- What are the differences between conductive cloth and conductive tape?
- How should seams, joints and gaskets be designed to avoid RF leakage?
- How do I design chassis bonding & grounding to minimize common-mode noise?
- High-frequency circuits experience severe interference. Which absorbing material is most effective?
- Chips generate a lot of heat. How do I determine the thickness and hardness of the thermal conductive material?
- How do I select thermal insulation materials for battery packs to ensure safety?
- How to balance electrical conductivity vs. thermal insulation when one component needs both?
- Which materials are best when you need both UL94 V-0 flame rating and RoHS/halogen-free compliance?
Electromagnetic shielding materials
An electromagnetic shielding material made by depositing a metal layer on a flexible textile fabric (such as polyester fiber) substrate through electroplating or chemical plating processes, combining the flexibility of fabric with the conductivity of metal.
Composite shielding materials made by coating conductive voltage-sensitive adhesive onto flexible substrates such as conductive cloth or metal foil achieve instant bonding and electromagnetic shielding.
High-temperature electromagnetic shielding materials, which are made by depositing a metal conductive layer on a polyimide (PI) film substrate through processes such as vacuum deposition, perfectly combine the high-temperature resistance of PI with the conductivity of metal.
A composite shielding material made by coating a flexible substrate such as conductive cloth or metal foil with conductive voltage-sensitive adhesive, achieving instant adhesion and electromagnetic shielding.
no data
Functional materials that can convert incident electromagnetic wave energy into heat energy and dissipate it can be used to suppress electromagnetic resonance and reduce signal reflection.
Thermal management materials used to fill the microscopic gaps between the heating element and the heat sink significantly reduce interfacial thermal resistance by establishing efficient thermal pathways.
Thermal management materials that utilize low thermal conductivity to effectively impede heat transfer are used to achieve thermal zoning and protect heat-sensitive components.
no data
Thermal Management Material Selection Guide
1
Assess Heat Source Power and Temperature Difference
For high power applications, choose high thermal conductivity silicone pads
2
Measure Installation Pressure and Clearance
For low-pressure applications, choose soft thermally conductive gel
3
Confirm Environmental and Insulation Requirements
When electrical insulation is required, choose thermal conductive silicone gaskets
4
Identify the Need for Thermal Insulation
Use aerogel insulation film to protect sensitive components
Scenario-based
solutions
We address real-world EMI and thermal design challenges with field-tested, integrated material solutions. By analyzing key application scenarios, we reveal how strategic selection and pairing of conductive and thermally engineered materials can optimize performance, reliability, and cost.
Challenges: The complex electromagnetic environment generated by the motor and electronic control system necessitates that the battery pack itself withstand vibration and shock, and prevent the propagation of thermal runaway to ensure system safety.
Comprehensive Solution:
Structural Grounding: SMT conductive pads are used between the battery pack casing and the management system (BMS) to provide high-strength, highly elastic contact, ensuring grounding stability under vibration.
Wire Harness Shielding: High-voltage and signal harnesses are wrapped with conductive cloth or shielded with sleeves to provide flexible 360-degree all-around shielding and suppress common-mode interference.
Thermal Management: Thermally conductive silicone pads are filled between the cells to create efficient heat conduction paths, helping to achieve uniform temperature between cells, with temperature differences controlled within 3°C. Simultaneously, aerogel insulation films are used between modules or in critical heat source areas to form thermal barriers, effectively blocking heat transfer during thermal runaway and buying valuable time for safe escape.
Comprehensive Solution:
Structural Grounding: SMT conductive pads are used between the battery pack casing and the management system (BMS) to provide high-strength, highly elastic contact, ensuring grounding stability under vibration.
Wire Harness Shielding: High-voltage and signal harnesses are wrapped with conductive cloth or shielded with sleeves to provide flexible 360-degree all-around shielding and suppress common-mode interference.
Thermal Management: Thermally conductive silicone pads are filled between the cells to create efficient heat conduction paths, helping to achieve uniform temperature between cells, with temperature differences controlled within 3°C. Simultaneously, aerogel insulation films are used between modules or in critical heat source areas to form thermal barriers, effectively blocking heat transfer during thermal runaway and buying valuable time for safe escape.
Challenges: Severe high-frequency signal interference, high power consumption and dense heat generation of the main chip, and extremely compact internal stacking space place stringent demands on the high-temperature resistance and high-frequency shielding effectiveness of the materials.
Comprehensive Solution:
PCB Grounding: Utilizing conductive PI film-wrapped SMT conductive foam achieves reliable grounding with low impedance and reflow solderability, perfectly withstanding 260℃ high-temperature processes.
Chip Heat Dissipation: High thermal conductivity graphite sheets are attached to the top of the processor and RF chip, utilizing their ultra-high planar thermal conductivity (1500 W/(m·K)) for rapid heat dissipation, preventing localized overheating.
Interference Suppression: Thin layers of absorbing material are attached to specific frequency interference sources inside the shielding cover, effectively absorbing high-frequency electromagnetic waves, reducing resonance and signal crosstalk, and improving signal integrity.
Comprehensive Solution:
PCB Grounding: Utilizing conductive PI film-wrapped SMT conductive foam achieves reliable grounding with low impedance and reflow solderability, perfectly withstanding 260℃ high-temperature processes.
Chip Heat Dissipation: High thermal conductivity graphite sheets are attached to the top of the processor and RF chip, utilizing their ultra-high planar thermal conductivity (1500 W/(m·K)) for rapid heat dissipation, preventing localized overheating.
Interference Suppression: Thin layers of absorbing material are attached to specific frequency interference sources inside the shielding cover, effectively absorbing high-frequency electromagnetic waves, reducing resonance and signal crosstalk, and improving signal integrity.
Challenges: Extremely high component density, numerous antenna areas, and a significant conflict between RF interference and heat dissipation space; the overall thin and light design requires ultra-thin materials.
Comprehensive Solution:
Partial Motherboard Shielding: Using ultra-thin conductive tape for partial mounting and shielding of the FPC and specific chips, replacing bulky shielding covers.
Camera Module Shielding: Applying omnidirectional conductive foam around the camera circuitry to provide comprehensive electromagnetic sealing while protecting delicate components.
Overall Heat Dissipation: Using ultra-thin thermally conductive silicone pads (0.25mm) between the chips and the metal frame, and combining a graphite heat sink and aerogel insulation film between the battery and the motherboard to precisely conduct heat and prevent heat buildup in the handheld area.
Comprehensive Solution:
Partial Motherboard Shielding: Using ultra-thin conductive tape for partial mounting and shielding of the FPC and specific chips, replacing bulky shielding covers.
Camera Module Shielding: Applying omnidirectional conductive foam around the camera circuitry to provide comprehensive electromagnetic sealing while protecting delicate components.
Overall Heat Dissipation: Using ultra-thin thermally conductive silicone pads (0.25mm) between the chips and the metal frame, and combining a graphite heat sink and aerogel insulation film between the battery and the motherboard to precisely conduct heat and prevent heat buildup in the handheld area.
Challenges: The CPU/GPU consumes enormous power and generates tremendous heat. High-speed signal transmission requires extremely low electromagnetic background noise. The system needs to operate 24/7 without interruption, demanding extremely high reliability.
Comprehensive Solution:
Chip Heat Dissipation: A high thermal conductivity phase change material is used between the CPU processor and the heatsink. It is solid at room temperature for easy installation, and transforms into a gel state during operation, filling microscopic gaps with extremely low thermal resistance.
Power Module Shielding: A composite gold shield is used to protect against strong interference sources such as the VRM (Voltage Regulator Module), with absorbing material attached inside the shield to suppress high-frequency noise radiation from the switching power supply.
Chassis Shielding: Metal-coated rubber-core conductive gaskets are used at the chassis panel and slots to provide excellent electromagnetic and environmental sealing.
Comprehensive Solution:
Chip Heat Dissipation: A high thermal conductivity phase change material is used between the CPU processor and the heatsink. It is solid at room temperature for easy installation, and transforms into a gel state during operation, filling microscopic gaps with extremely low thermal resistance.
Power Module Shielding: A composite gold shield is used to protect against strong interference sources such as the VRM (Voltage Regulator Module), with absorbing material attached inside the shield to suppress high-frequency noise radiation from the switching power supply.
Chassis Shielding: Metal-coated rubber-core conductive gaskets are used at the chassis panel and slots to provide excellent electromagnetic and environmental sealing.
no data
Still unsure which option to choose?
Submit your specific application requirements (e.g., operating frequency, ambient temperature, installation space), and our technical experts will provide you with a free customized material selection solution and sample support within 24 hours.
Expert In Custom Solutions For More Efficient Electromagnetic Shielding Components
no data
Mob:+86 189 1365 7912
Tel: +86 0512-66563293-8010
Email: sales78@konlidacn.com
Address: 88 Dongxin Road, Xukou Town, Wuzhong District, Suzhou City, Jiangsu Province, China
ABOUT US
Copyright © 2025 KONLIDA | Sitemap