As smartphones, TWS earbuds, and smartwatches become thinner and more integrated, traditional metal spring contacts (Pogo pins) increasingly fail to meet the grounding and EMI reliability requirements of modern electronics. Leading global brands are now switching to a compact but highly reliable material: the SMT Gasket.
Below is why it is becoming the new standard in precision grounding and EMI suppression.
An SMT Gasket is a surface-mount EMI shielding component composed of:
A high-elasticity silicone core
A conductive PI (polyimide) outer layer
A metal solder pad at the bottom for reflow attachment
It is placed directly onto the PCB via standard SMT equipment and fixed through reflow soldering. This structure delivers stable grounding, EMI shielding, and mechanical cushioning in one compact design.
To learn more about conductive foam fundamentals, see: What Is Conductive Foam?
Ground resistance ≤ 0.03 Ω
Passes 260°C reflow with no delamination or blistering
After 24-hour salt spray, resistance remains < 0.06 Ω
Such impedance stability is critical for RF-sensitive systems. For further EMI grounding insights, see: EMI Shielding in Electronics: The "Hardcore Expert" — Conductive Foam
Fully compatible with standard SMT assembly lines
99.5% placement yield
Eliminates manual dispensing or alignment
Ideal for high-volume consumer electronics production
90% recovery after 50% compression
Stable contact under drop and vibration conditions
Protects FPC joints, antenna structures, and shielding interfaces
For material performance and recoverability reference, see: Conductive Foam Compression–Recovery Curve Analysis
| Product Type | Application Use Case | Performance Benefit |
|---|---|---|
| TWS earbuds | PCB-housing grounding | Eliminates RF noise; improves audio clarity |
| Smartwatches | Antenna feed-point contact | Stable impedance; stronger wireless signals |
| Laptops | Shield-can grounding | Longer lifespan vs. easily-fatigued metal springs |
| Automotive ECUs | Heat-resistant grounding (>150°C) | Long-term electrical reliability in harsh environments |
Konlida is one of the few manufacturers capable of mass-producing SMT Gaskets with micron-level precision. We provide customized solutions for top-tier supply chains, including leaders in consumer electronics and automotive electronics.
3-day rapid prototyping
Custom dimensions down to 1.2 × 1.2 mm
Optional tin-plated or gold-plated PI
Full-process quality control in ISO-certified cleanrooms
Customer feedback:
“After switching to Konlida SMT Gaskets, our SMT pass-through rate increased by 2%, and grounding-related complaints dropped to zero.” — Leading TWS Brand
If you are developing:
Smartphones, TWS earbuds, smartwatches
On-board automotive electronics (OBC, ADAS, ECU)
5G, WiFi 6, GNSS communication modules
Then SMT Gaskets are the most stable, compact, and automation-ready grounding solution.
Contact Konlida to request samples or a customized technical proposal.
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