From Gap Filling to Impedance Control: How Konlida Advances Conductive Foam in EMI Shielding

Conductive Foam in Next-Generation Electronics

On September 4, 2025, Huawei is set to launch its latest Mate XTs foldable phone and new smart displays. Behind these highly integrated, high-frequency devices lies an invisible yet essential technology—EMI shielding. Ensuring clean signals and stable systems in ultra-thin devices requires innovative shielding solutions such as conductive foam.

As a long-term materials partner to Huawei, Suzhou Konlida Precision Electronics Co., Ltd. is driving a shift from the traditional role of conductive foam as a simple gap filler to a system-level impedance control solution.

Why Gap Filling Is No Longer Enough

Traditionally, conductive foam was treated as a gasket for sealing enclosure gaps. But with the rise of 5G, Wi-Fi 6E, and millimeter-wave communication, the internal electromagnetic environment of electronic devices has become far more complex.

“Today, the question is not whether conductive foam is used, but whether it works effectively,” said Konlida’s technical director. “We focus on lowering interface impedance between the material and metal housings to create a reliable, low-loss discharge path for high-frequency noise.”

According to IEC 61000-4-21, shielding effectiveness at GHz frequencies depends heavily on contact resistance. If resistance is too high, even full coverage may leave electromagnetic leakage points.

For related EMI reliability issues in silicone-based shielding, see Hidden Corrosion of Conductive Silicone Rubber.

Konlida’s Technology Breakthrough

To address these challenges, Konlida developed gradient composite plating technology for conductive foam. By applying multiple metallic coatings, the foam achieves:

• Higher conductivity and adhesion

• Greater durability under compression

• Stable grounding performance across temperature shifts

Konlida also provides solution-based services, including:

• DFM (Design for Manufacturability) support

• Assembly pressure optimization

• Comprehensive testing and validation

Its Suzhou production base features die-cutting, rotary tooling, thermoforming, and a Class 1000 cleanroom, with annual capacity exceeding 1 billion pieces. Customers include Huawei, Apple, Xiaomi, and NIO.

From Materials Supplier to System Partner

“Konlida is not just a materials supplier but a partner in EMI system design,” the company stated. “We engage early in product development to solve EMI issues upfront rather than post-production.”

Founded in 2006, Konlida specializes in EMI shielding, thermal management, and precision die-cutting. The company holds ISO9001, IATF16949, and ISO13485 certifications, with a workforce of over 300 employees.

Recent innovations include:

• SMT conductive foam

• FOF wraparound foam

• AIR LOOP shielding materials

• Optical light-blocking films

For compact EMI shielding in device-level applications, see SMT Gaskets｜Compact Yet Powerful EMI Protection.

Industry Perspective

As smart devices evolve toward higher integration and stronger performance, EMI design is shifting from reactive fixes to proactive prevention. Konlida’s transformation from a materials manufacturer to a solution provider reflects the broader upgrade of China’s supply chain capabilities.

Each new Huawei launch is not only a display of brand strength but also the result of supply chain co-innovation. In this landscape, a small piece of conductive foam plays a big role in maintaining signal integrity and system balance. With strong process expertise and customer-driven service, Konlida continues to enable the leap forward of Made in China.