SMT Gaskets｜Compact Yet Powerful EMI Protection for Electronic Devices

Konlida SMT Gaskets are made of a highly elastic silicone core (or high-temperature foam) wrapped with conductive PET or PI films plated with metal. They are a new type of solderable conductive foam that provides reliable grounding points directly on printed circuit boards.

01. Types of SMT Gaskets

SMT conductive foam gaskets offer balanced conductivity, durability, heat resistance, and stable electrical grounding.

They can function as EMI shielding gaskets or replace mechanical antenna springs. Additionally, they provide cushioning against mechanical shock, preventing damage to nearby components.

For an overview of conductive foams, see What Is Conductive Foam? Uses, Applications, and EMI Shielding Benefits.

1. Wrapped Extruded Silicone Type

Structure: Conductive layer (conductive PI or metallic foil) wrapped around extruded silicone strips. This is one of the earliest and most widely used structures.

• Advantages: Stable compression, excellent wear resistance, customizable in small sizes.

• Disadvantages: Slightly weaker rebound force compared to foamed silicone type.

2. Wrapped Open-Cell Silicone Foam Type

Structure: Conductive layer wrapped around modified open-cell silicone foam.

• Advantages: High compression ratio, requires lower pressure.

• Disadvantages: Difficult to produce at very small dimensions (1–2 mm).

3. Wrapped Standard Silicone Foam Type

Structure: Conductive layer wrapped around regular silicone foam, mainly fixed by adhesive, no soldering required.

• Advantages: Lower cost.

• Disadvantages: Less precision and risk of thermal expansion.

4. Wrapped Extruded Silicone Sponge Type

Structure: Conductive layer wrapped around extruded sponge-like silicone foam, designed to avoid buckling after compression.

• Advantages: Concave shape option, preventing interference with adjacent components.

• Disadvantages: Limited precision, uneven rebound force.

5. Extruded Conductive Silicone Type

Structure: Conductive layer applied to extruded conductive silicone, available in coated or co-extruded forms. Typically used in high-frequency compression applications with sealing and grounding requirements.

• Advantages: Easier production, good weather resistance.

• Disadvantages: Risk of surface powder shedding.

For deeper technical insights, see Key Performance Indicators and Selection Guide for SMT Gaskets.

02. Performance Parameters

Advantages of Konlida SMT Gaskets

• Precise Adaptation – tailored to diverse design requirements

• Superior Reliability – stable EMI performance and grounding

• Fast Delivery – responsive to customer needs

03. Failure Cases & Solutions

• Cold solder joints / misalignment
  

• Compression with poor rebound
  

• Cracks in PI or metallic layer