Why Leading Brands Choose Konlida for Conductive Foam Solutions

As 5G devices, wearable electronics and electric vehicles continue to accelerate in complexity, conductive foam has evolved from an optional accessory to a mission-critical component in EMI shielding and reliable grounding. In this high-precision segment, Konlida Precision Electronics Co., Ltd. is becoming a preferred partner for brands including Apple, Xiaomi, Huawei and Li Auto.

Konlida was founded in 2006 and has grown into a trusted supplier in global electronics and automotive supply chains. Its strong technical depth and manufacturing capabilities are core to its differentiation.

About Konlida

Konlida is a national high-tech enterprise specializing in electromagnetic shielding materials and precision die-cut manufacturing. Headquartered in Suzhou, China, the company operates:

• 30 conductive foam production lines

• 10 precision die-cutting lines

• Class-1K cleanroom and Class-100 micro-assembly zone

• Certifications including IATF 16949, ISO 9001 and RoHS

Since the mass production launch of its SMT Gasket line in 2017, Konlida has served more than 200 global customers across mobile electronics, wearables, computing, automotive electronics, radar and high-frequency communication.

For deeper insights into SMT-ready shielding materials, see: SMT Gaskets｜Compact Yet Powerful EMI Protection for Electronic Devices

Core Product Strengths

SMT Gasket

• Designed for 260°C reflow

• Ground resistance ≤ 0.03 Ω

• Compatible with standard SMT pick-and-place lines

• Ideal for PCB grounding and antenna feedpoint connection

Air Loop Gasket (Patented)

• D-shaped hollow architecture prevents tilt during compression

• Internal FPC routing capability

• 30 percent weight reduction with thickness down to 0.5 mm

• Adopted in multiple leading TWS platforms

Learn more about PCB-level EMI isolation:
PCB EMI Shielding: From Point Protection to System-Level Isolation

Automotive-Grade Conductive Foam

• Operating range: −40°C to +150°C

• Passed 1000-hour high-temperature aging and salt-spray validation

• Meets CISPR 25 and GB/T 18655 automotive EMC requirements

• Applications: OBC, BMS, ADAS radar modules

Full-Coverage Conductive Foam

• Fully plated foam with 3D electrical continuity

• Shielding effectiveness >75 dB (10 MHz–10 GHz)

• More cost-effective than metal springs; supports complex die-cut structures

Why Leading OEMs Trust Konlida

Proprietary Process and Equipment

Konlida builds its own forming and encapsulation equipment (now in its third generation), enabling superior seam stability, thermal expansion control and dimensional consistency. The company holds multiple patents related to conductive foam architecture and packaging.

To explore failure modes and micro-scale degradation mechanisms, reference: Hidden Corrosion of Conductive Silicone Rubber: How Micro-Scale Electrochemistry Undermines EMI Reliability

End-to-End Quality Control

• XRF environmental inspection for all incoming raw materials

• Full inspection of critical dimensions using 2.5D metrology

• 100 percent visual and functional verification before shipment

Rapid Engineering Response

• Prototype delivery within 3 days

• Small-batch manufacturing in 7 days

• Custom dimensions as small as 1.2 mm × 1.2 mm

• Multiple packaging options: carrier tape, reel, blister tray and custom formats

Engineering Collaboration Beyond Material Supply

• EMC simulation recommendations

• Impedance matching analysis

• PPAP documentation support for automotive programs

• Ongoing yield tracking and design optimization

Delivering More Than Materials: Complete EMI Solutions

Customer feedback reflects Konlida’s value not only as a material provider but as a technical partner:

“After switching from metal springs to the Air Loop Gasket, our TWS drop-test failure rate dropped to zero and SMT through-rate increased to 99.6 percent.”
Tier-1 audio brand partner

“Konlida is the only domestic conductive foam supplier that passed our partial AEC-Q200 stress validation.”
EV Tier-1 integrator

Contact Konlida

If your team is developing next-generation consumer electronics, automotive electronics or communication devices and requires high-performance EMI grounding materials, Konlida provides free samples and engineering support.

Company: Suzhou Konlida Precision Electronics Co., Ltd.
Address: No. 88 Dongxin Road, Xukou Town, Wuzhong District, Suzhou, Jiangsu, China
Email: sales78@konlidacn.com
Website: www.konlidainc.com