Konlida Launches Ultra-Thin Nickel Foil EMI Shielding Material for Compact Devices
Driving the Next Wave of Miniaturization in EMI Shielding
As Apple’s iPhone 17 series pushes the limits of internal compactness and system integration, the demand for high-performance EMI shielding in dense electronic layouts continues to grow. Achieving effective electromagnetic protection within extremely limited space has become a shared engineering challenge for OEMs and component suppliers.
In response, Suzhou Konlida Precision Electronics Co., Ltd. (Konlida) has unveiled a next-generation EMI shielding material based on ultra-thin nickel foil–polyimide composite technology. With a minimum thickness of 12 micrometers, the new material combines excellent conductivity, mechanical flexibility, and environmental durability, making it ideal for smartphones, wearables, and automotive electronic modules.
Ultra-Thin Yet High-Performance: Achieving Efficient Shielding in 12μm
The material utilizes a 6μm electro-deposited nickel foil laminated with a high-performance polymer film, achieving lower surface resistance and enhanced shielding effectiveness compared to traditional conductive fabric solutions.
It demonstrates exceptional EMI suppression across 30 MHz to 1 GHz, effectively reducing power noise and RF crosstalk.
“With the widespread adoption of FPCs and Mini-SLP motherboards, conventional shielding materials can no longer balance space and performance,” said Konlida’s technical team. “Our nickel foil material maintains mechanical integrity while significantly reducing thickness, allowing seamless application on complex curved surfaces.”
Superior Properties: High Temperature, Corrosion, and Flame Resistance
Beyond its ultra-thin structure, the nickel foil material delivers robust multi-functional performance:
-
High-temperature resistance up to 270°C, supporting SMT reflow soldering.
-
Excellent oxidation and corrosion resistance, suitable for high-humidity or salt-fog environments.
-
Flame-retardant to improve product safety and reliability.
These features make it applicable not only to consumer electronics but also to EV electronic control modules, medical diagnostic instruments, and 5G communication base stations, where high EMI reliability is crucial.
Advancing Domestic Material Innovation
The launch of this nickel foil material marks another step forward in Konlida’s long-term R&D efforts in electromagnetic shielding materials.
Since its establishment in 2006, the company has focused on EMI shielding, thermal management, and precision die-cutting, serving leading global brands including Apple, Huawei, and Xiaomi.
With 18 years of process expertise and a 45,000 m² intelligent manufacturing base, Konlida has built a complete technology chain—from material compounding and precision converting to automated assembly—enabling customized EMI shielding solutions tailored to various application scenarios.
“Our goal is to solve real design challenges through materials innovation,” said a Konlida representative. “The mass production of this nickel foil material demonstrates our technological strength in advanced functional materials and provides greater flexibility for domestic supply chains.”
Currently, the material has completed technical verification with several top-tier electronics manufacturers and has entered pilot production. Moving forward, Konlida plans to expand research into nickel-iron alloys and nickel-plated copper foils for next-generation high-frequency and high-temperature applications.
About Suzhou Konlida Precision Electronics Co., Ltd.
Founded in 2006, Konlida specializes in EMI shielding, thermal management, and precision die-cutting solutions for industries including electronics, telecommunications, automotive, and medical devices.
Certified with ISO9001, IATF16949, and ISO13485, the company produces over 1 billion parts annually and is committed to delivering high-performance, customized functional materials worldwide.
Suggested Internal Links:
ABOUT US