EMI Shielding Materials introduction
01. Conductive Foam
Conductive foam typically consists of sponge or PORON wrapped in conductive fabric or conductive PI. The primary characteristic of this foam is its excellent surface conductivity, which allows it to be easily affixed to devices needing shielding using adhesive tape.
02. Conductive fabric
Our conductive fabric is designed for use in various electronic devices, providing effective solutions for static electricity (ESD) protection and grounding applications. These materials come in multiple forms and are widely used in communication devices, computers, automatic control equipment, and mobile phones.
Key Features:
● Texture Types: Plain weave, grid weave.
● Colors: Available in silver-grey, black, and gold.
● Varieties: Copper-nickel conductive fabric, aluminum foil conductive fabric, carbon-coated conductive fabric, gold-coated conductive fabric, fiberglass conductive fabric.
● Thickness Options: 0.018T, 0.035T, 0.05T, 0.08T, 0.11T (customizable upon request).
● Surface Resistance: ≤0.03Ω.
● Flame Retardancy: Optional (up to 94V-0).
Comparative Advantages |
|||
Product |
Thickness |
Surface Resistance |
Shielding Effectiveness (dB) |
Our Conductive Fabric |
0.018 mm |
≤0.05 Ω/sq |
>60 dB (10 MHz - 3 GHz) |
Our Conductive Fabric |
0.05 mm |
≤0.03 Ω/sq |
>60 dB (10 MHz - 3 GHz) |
Market Conductive Fabric |
0.03 mm |
≤0.07 Ω/sq |
>60 dB (20 MHz - 1 GHz) |
03. Polyimide film
Our High-Conductivity PI (Polyimide) film is engineered with a range of advanced features, including low electrical resistance, high shielding effectiveness, heat resistance, and solderability. This film is designed for use in complex electromagnetic environments, offering broad shielding bandwidth, low density, and superior thickness uniformity. It is also highly resistant to oxidation, making it ideal for applications in electronic communications, mobile devices, laptops, and electronic tags.
Technical Specifications |
|||
Parameter |
Unit |
Value |
Test Standard |
Color |
------ |
Silver-grey |
Visual Inspection |
Thickness |
mm |
0.016 ± 0.0032 |
FZ/T01003-1991 |
Thickness |
mm |
0.025 ± 0.0032 |
FZ/T01003-1991 |
Width |
mm |
460 ± 30 |
------- |
Length |
m |
50m/Roll |
GB/T4669-1995 |
Shielding Effectiveness |
dB |
>75 |
ASTM D4935-99 |
Surface Resistance |
Ω/Sq |
≤0.03 |
ASTM F390 |
Salt Spray Test |
Ω/Sq |
<0.06 |
ASTM B117-03 |
Operating Temperature |
℃ |
-40 to 280 |
------- |
Frequency Range |
------ |
10MHz ~ 3GHz |
------- |
ROHS Compliance |
------ |
Halogen and heavy metal-free |
IEC62321 |
04. All directional conductive foam
The all-directional conductive foam is produced using advanced polymer composite foam technology, resulting in uniform cell size, softness, elasticity, and non-shedding properties. This foam evenly distributes to protect device pins and exhibits corrosion resistance, making it an ideal material for long-term device storage. Our latest research and development have produced all-directional conductive foam that can withstand temperatures up to 200°C.
Key Features:
● Temperature and Humidity Stability: The conductive foam is unaffected by temperature and humidity changes.
● Customizable Surface Resistance: Surface resistance values can be tailored to specific applications.
● Customizable Density: Density can be adjusted as needed.
● Adhesive Options: Available with double-sided adhesive or for use with other substrates.
● Thickness Options: Various thicknesses are available.
Product Specifications |
|
Specification |
Value |
Surface Resistance |
≤0.05 Ω/inch |
Vertical Resistance |
≤0.03 Ω/inch |
Shielding Effectiveness |
50-80 dB (10 MHz - 3 GHz) |
Heat Resistance |
-40℃ to 120℃ |
Tensile Strength |
≥1.3 kg/25 mm |
Initial Adhesion |
1200 g/25 mm |
Adhesion Retention |
1000 Min/inch |
04. Conductive Rubber
Conductive Rubber is a flexible, high-performance material designed for effective EMI shielding. It offers excellent elasticity, strong durability, and reliable performance in various temperatures. Ideal for electronic applications, it can be customized in shape and thickness, making it a versatile choice for protecting sensitive components.
Features and Advantages:
● Excellent elasticity with a soft surface
● Superior EMI shielding effectiveness, exceeding 80dB
● High-temperature vulcanization ensures strong intermolecular bonding
● Material-saving and reduces labor and assembly time
● Eliminates the need for costly molds and supports rapid prototyping
● Available Shapes: Square, Half-Round, Triangle
Product Specifications |
|||
Parameter |
Unit |
Value |
Test Standard |
Color |
------ |
Grey |
Visual Inspection |
Base Material |
------ |
Silicone Rubber |
------ |
Thickness |
mm |
Customizable |
------ |
Surface Resistance |
Ω |
< 0.2 (Rubber Surface) |
------ |
Surface Resistance |
Ω |
< 0.01 (Copper Foil Surface) |
------ |
Vertical Resistance |
Ω |
< 0.05 |
------ |
Shielding Effectiveness |
dB |
> 80 |
MIL-DTL-83528C |
Elongation at Break |
% |
100 |
ASTM D412 |
Tensile Strength |
PSI |
150 |
ASTM D412 |
Operating Temperature |
℃ |
-55~+125 |
------ |
Flammability Rating |
------ |
HB |
UL94 |
05. Wave Absorption Materials
Soft magnetic composite magnetic sheets are made by uniformly mixing micron-sized flaky alloy magnetic powder with special resin and pressing them into a wide-band electromagnetic noise suppression sheet. These sheets exhibit excellent EMI noise suppression performance and are flexible and easy to apply. They can achieve broadband absorption and shielding from high frequencies of 1GHz to 40GHz, addressing the limitations of traditional silicone-based absorbing materials. Additionally, they can meet ultra-thin gap structure requirements, offering excellent thermal conductivity and good adhesion. The sheets can be easily applied and removed without leaving residue on the surface.
Applications:
● High-frequency noise absorption and shielding for communication industry chips.
● Noise suppression near high-frequency boards in special industrial control electronics.
● EMI noise reduction at high-frequency board locations.
● EMI shielding for ADAS smart driving chip locations.
Technical Specifications |
|||
Test Item |
Typical Value |
Unit |
Test Method |
Color |
Dark Grey |
--- |
Visual Inspection |
Total Thickness |
0.09~0.10 |
mm |
ASTM D3564 |
Absorbing Material Thickness |
0.07 |
mm |
ASTM D374 |
Density |
3.6 |
g/cm³ |
ASTM D792 |
Surface Resistance |
>1.0x10^6 |
Ω |
--- |
Thermal Conductivity |
2 |
W/(m·K) |
ASTM D5470 |
Relative Permeability (μ') |
4 @5GHz |
--- |
Agilent E4991B |
Relative Permeability (μ") |
3.6 @5GHz |
--- |
Agilent E4991B |
Dielectric Constant (ε') |
118 @5GHz |
--- |
--- |
Dielectric Constant (ε") |
5.8 @5GHz |
--- |
--- |
Shielding Effectiveness |
>12 |
dB |
1G-40GHz |
Recommended Operating Frequency |
1~40 |
GHz |
--- |
Adhesion Performance |
>0.8 |
N/25mm |
ASTM D3330 |
Operating Temperature |
-20~80 |
℃ |
--- |
Please feel free to reach out to us with any questions, comments, or concerns. You can contact our customer support team at phone number or email address. We are here to assist you in any way we can. Thank you for choosing to connect with us.
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