Learn how optimized EMC design enables MCU and OBC systems to pass automotive EMI tests on the first attempt. Real-world cases reveal why rework fails—and how material, grounding, and structure must be engineered together.
Discover how Konlida delivers automotive-grade EMI shielding solutions for EV chassis domain controllers, ensuring EMC compliance and supporting ASIL-D functional safety in harsh electromagnetic environments.
Unstable signals, EMI failures, and costly redesigns often trace back to SMT gasket design errors. Learn the top PCB, compression, and placement mistakes—and how SMT gaskets ensure reliable grounding in consumer electronics.
Frequent signal drops in smartphones and tablets are often caused by grounding failure—not antennas. This article explains the EMI root causes and shows how SMT conductive foam ensures stable grounding for 5G and Wi-Fi 6E devices.
A complete guide to SMT Gaskets, covering construction, EMI shielding performance, material selection, and engineering considerations for 5G devices. Includes key parameters, comparison charts, and practical design guidance.
A complete technical guide to conductive foam solutions, covering SMT Gasket technology, Air Loop Gasket structural innovations, and full-coverage conductive foam for high-frequency EMI shielding. Includes selection criteria, application cases, and advanced material insights for 5G, satellite communications, and automotive electronics.
An analysis of how Konlida's conductive foam solutions address EMI shielding & grounding challenges across consumer electronics, automotive, communications and medical devices. Includes SMT Gasket, Air Loop Gasket and full-stack customization.
A complete 2025 SMT Gasket selection guide covering structure types, key specifications, EMI shielding performance, and application scenarios. Learn how to choose the right SMT conductive gasket and explore Konlida's advanced EMI solutions.
Konlida SMT gasket offers a breakthrough EMI shielding and grounding solution for surface-mount applications. Designed for high precision and reflow soldering up to 260°C, it ensures reliability in compact electronic devices.
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