An SMT Gasket (Surface-Mount Conductive Gasket) is a PCB-level conductive elastic terminal designed for high-density electronics. It typically consists of a silicone or foamed silicone core wrapped with a conductive PI layer, enabling stable electrical grounding and mechanical cushioning in compact devices.
Core Advantages
Strong EMI/ESD shielding — Provides a low-impedance grounding path for suppressing high-frequency interference.
SMT reflow compatible — Supports standard 260°C reflow soldering for automated assembly.
Excellent buffering performance — Absorbs impact energy and protects delicate modules.
High reliability — Qualified through salt spray, humidity, and thermal shock testing.
Typical Use Cases
Smartphones, notebooks, antennas, PCB-to-FPC grounding, module shielding, and connector replacement.
👉 Related reading:
What Is Conductive Foam?
https://www.konlidainc.com/whaticle.html
SMT Gaskets differ mainly in the design of the silicone core and the conductive wrapping layer. According to Konlida’s engineering data, the three mainstream structures include:
| Structure Type | Description | Key Advantages | Limitations | Recommended Applications |
|---|---|---|---|---|
| Conductive PI-Wrapped Extruded Silicone Foam | Extruded foamed silicone wrapped with conductive PI film | - Strong anti-tilt stability - Flexible custom geometry |
- Silicone expansion at high temp - Larger thickness tolerance |
Custom designs requiring high compression stability |
| Conductive PI-Wrapped Open-Cell Silicone Foam | Modified open-cell silicone foam with PI wrap | - High compression range & low force - Wear-resistant & stable - Ideal for small sizes (1–2 mm) |
Slightly lower rebound force | TWS earbuds, compact modules requiring high compression travel |
| Conductive PI-Wrapped Solid Silicone Foam | Solid silicone foam wrapped with PI | - Cost-effective - Can use adhesive (no soldering required) |
- Lower dimensional precision - Thermal expansion risk |
Non-critical, cost-sensitive EMI grounding |
👉 Further reading:
Fabric over Foam Gaskets: Performance Analysis
https://www.konlidainc.com/fof.html
Correct SMT Gasket selection requires evaluating electrical, mechanical, and environmental parameters.
Surface resistance: ≤ 0.05 Ω/inch (ASTM F390)
Vertical resistance: ≤ 0.03 Ω/inch (DS/EN 1149-2)
Contact impedance: ≤ 0.03 Ω
Recommended compression: 10–40%
Rebound rate: ≥ 90% (Konlida test: 94.8% after 168 hours)
Compression set: ≤ 32% (70 h @ 100°C)
Reflow compatible: 260°C
Operating temperature: –40°C to +150°C
Salt spray test: 24h with no resistance degradation
Compliance: RoHS, halogen-free (IEC 62321)
Minimum size: 1.5 mm × 1.0 mm
Thickness: From 0.3 mm for ultra-thin designs
5G devices require higher shielding effectiveness, wider frequency bands, lower thickness, and better thermal conductivity.
Konlida’s response:
High-temperature conductive PI film (up to 300°C)
Conductive fiberglass fabrics for enhanced structural strength
LOOP-structure conductive foam for reduced weight, lower profile, and internal circuit connectivity.
Magnetic nanoparticle-enhanced SMT Gaskets
Combined shielding + absorption for eliminating harmonic interference
👉 Related technical insights:
Breaking the EMI Failure Curse: Impedance Control Innovations
https://www.konlidainc.com/article/foam.html
From conductive PI film to silicone extrusion, forming, and carrier-tape packaging—Konlida controls the entire supply chain for consistent quality and competitive cost.
Supports large-scale stable supply and quick delivery for small-batch custom models.
Samples in as fast as 2 days (when materials are available).
Certified by ISO9001 and IATF16949, with complete incoming inspection, process monitoring, and final testing.
Long-term partner of leading international electronics companies, delivering high-reliability EMI shielding components.
Konlida provides free sample evaluations, application analysis, and professional EMI design support.
Suzhou Konlida Precision Electronics Co., Ltd
Website: www.konlidainc.com
Email: sales78@konlidacn.com
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