Suzhou Konlida Precision Electronic Co., Ltd., founded in 2006 and headquartered in Suzhou, China, is a high-tech enterprise specializing in EMI/RFI shielding materials and precision die-cutting. We provide advanced electromagnetic shielding and thermal management solutions for consumer electronics, communication devices, and automotive electronics.
Standard Conductive Foam: PU or PORON foam wrapped with conductive fabric, ideal for antenna and chassis sealing.
SMT Conductive Foam: Surface-mountable on PCBs for grounding or antenna connections, compatible with reflow soldering.
AIR LOOP Conductive Foam: Innovative D-shaped structure, lightweight and thin, internal wiring possible, widely used in Apple products.
Omnidirectional Conductive Foam: Fully metal-plated, providing excellent 3D shielding at low cost.
High elasticity, corrosion-resistant, non-magnetic, ideal for shield contact points.
Silver or nickel particles evenly embedded in silicone, offering sealing and EMI shielding for military and high-end electronics.
Electromagnetic wave absorption to prevent interference, suitable for high-frequency applications like 5G and ADAS chips.
Includes thermal silicone pads, graphite sheets, aerogel insulation films, and graphite-copper composites for efficient heat dissipation.
Strong focus on new shielding and thermal materials.
Developed AIR LOOP conductive foam to prevent traditional foam collapse, applied in multiple Apple products.
| Process | Capability |
|---|---|
| Slitting | 5 slitting machines for daily material prep |
| Stamping | 300㎡ clean stamping workshop, 30+ high-speed servo presses |
| Die-cutting | Supports rotary & flat die-cutting, high precision |
| Forming & Wrapping | Combination of machines & manual work for straight, curved, and combined parts |
| Inspection & Packaging | Class 1000/100 cleanroom, full inspection |
Class 1000 and Class 100 cleanrooms ensure consistent high-quality products.
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Key Characteristic |
Products |
Industries |
|
Polyurethane (PU |
Soft, compressible, cost-effective |
|
Consumer Electronics, Telecom |
|
Polyethylene (PE |
Lightweight, shock absorbing |
|
Industrial Electronics, Power Systems |
|
Polyimide (PI |
Flame resistant, |
PI |
Aerospace, EV Battery, Defense |
|
PORON® Urethane |
Long-term compression resistance |
PORON |
Smartphones, Wearables, Battery Packs |
|
EPDM |
Excellent |
EPDM |
Automotive, Telecom Cabinets |
|
Neoprene (CR |
Oil/chemical resistant, durable |
CR |
Industrial Equipment, Power Cabinets |
|
NBR |
Fuel/oil resistant, good compression set |
NBR |
Automotive Fuel Systems |
|
EVA |
Lightweight, easy processing, good |
EVA |
Consumer Devices |
|
Graphite |
High |
Graphite |
|
|
|
Wide temperature range, UV & weather resistant, durable |
|
Automotive, Medical, Outdoor |
Shape: D-shape, P-shape, square, irregular
Size: Min edge 0.4mm, flatness ≤0.1mm
Material Combo: Custom fabric, foam, and adhesive
Adhesive Design: Single/double-sided, release liner, pull-tab option
Packaging: Tape & reel, blister, roll
Mold design, structural simulation, impedance matching
Quick prototyping from customer drawings, samples in 3 days
| Stage | Common Issue | Control Measure |
|---|---|---|
| Raw Material | Resistance failure, surface contamination | XRF spectroscopy, Dyne test |
| Slitting | Width deviation, burrs | Regular blade calibration, dimension monitoring |
| Die-cutting | Wire drawing, waste retention | Die depth optimization, bottom film tension check |
| Inspection | Missing/shifted adhesive | Full inspection, batch tracking with QR codes |
SOP compliance, certified operators, regular training
Salt spray (ASTM B117), thermal shock, contact impedance, humidity aging, compression set
Requirement: High shielding at monitor-chassis contact, lightweight
Solution: AIR LOOP conductive foam replaces metal clips
Results: 20% improved shielding, 35% weight reduction, 50% faster assembly
Requirement: Stable antenna grounding, drop resistance
Solution: SMT conductive foam soldered on PCB
Results: Grounding <0.03Ω, rebound rate >92%, automated assembly
Requirement: Local insulation & overall heat dissipation
Solution: Aerogel film (0.018 W/m·K) + graphite sheet (1200 W/m·K)
Results: Local temp drop 6°C, 40% improved device cooling
| Dimension | Konlida | Traditional Supplier |
|---|---|---|
| Product Type | SMT, AIR LOOP, Omnidirectional | Standard parts, limited customization |
| Production Environment | Class 1000/100 cleanroom | General workshop |
| Lead Time | Quick sample in 3 days | 7–14 days |
| Cost Control | In-house mold design | Third-party molds |
| Technical Service | Simulation, material recommendation, structure optimization | Standard spec only |
Company: Suzhou Konlida Precision Electronic Co., Ltd.
Address: No.88 Dongxin Rd, Xukou Town, Wuzhong District, Suzhou, Jiangsu, China
Phone: +86 18913657912
Website: www.konlidainc.com
Advanced Technology: AIR LOOP & SMT foam expertise
Strong Customization: Shapes, materials, processes fully customizable
Strict Quality: Full-process inspection, RoHS/REACH compliant
Efficient Delivery: In-house production, rapid response
Industry Experience: Serving Apple, Xiaomi, Huawei
Konlida is more than a material supplier — we are your long-term partner in EMI shielding and thermal management solutions.
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