Say Goodbye to Solder Failures — Konlida SMT Gasket

In modern electronics such as smartphones, computers, and automotive systems, even a minor grounding issue can trigger signal interference, performance degradation, or complete failure.
Traditional metal springs or conductive pads often struggle with compression fatigue, misalignment during reflow, or surface cracking.

To address these challenges, Konlida Precision Electronics introduces a revolutionary innovation — the SMT Gasket, an intelligent EMI shielding component designed for direct SMT reflow soldering integration.

What Is SMT Gasket?

Unlike regular foam pads, SMT conductive gasket hybrid precision component that combines a highly elastic core with a durable conductive outer layer.

Core Structure Highlights:

• Elastic Core:
  Made of extruded silicone or modified high-temperature foam with over 90% compression recovery, maintaining elasticity after long-term compression.

• Conductive Layer:
  Coated with Konlida’s proprietary tin-plated or gold-plated PI or nickel-plated PI film, providing low resistance and stable solder bonding under high-temperature SMT reflow.

This design merges the flexibility of foam with the conductivity of metal, offering superior EMI protection and mechanical stability.

(Learn more about conductive foam technology in our article: What Is Conductive Foam? Uses, Applications, and EMI Shielding Benefits)

Why Choose Konlida SMT Gasket?

Through extensive failure analysis in real-world applications, Konlida optimized its SMT gasket to address common industry pain points:

Common Issue	Konlida’s Engineering Solution
Solder misalignment / cold joints	✅ Gold-plated PI enhances solder adhesion and prevents floatation. ✅ Air-release grooves under the base reduce flux buoyancy during reflow.
Poor compression recovery	✅ Internal cavity design optimized via finite element simulation. ✅ Customized silicone compound improves thermal stability and rebound.
Surface cracking / PI delamination	✅ Reinforced high-modulus PI film resists bending fatigue. ✅ Thicker copper coating improves durability. ✅ Internal structure allows outward deformation to prevent stress concentration.

Reliable Performance You Can Measure

• High Reliability:
  94.8% rebound after 168-hour compression — exceeding industry standards.

• Excellent Conductivity:
  Surface resistance ≤ 0.05 Ω/sq, EMI shielding effectiveness > 75 dB.

• Reflow Compatibility:
  Supports 260°C SMT reflow soldering, ideal for automated production lines.

• Eco-Friendly & Safe:
  RoHS and UL94-V0 compliant, halogen-free and heavy-metal-free.

(Explore more advanced solutions: SMT Gaskets: High-Precision EMI Shielding and Automation-Ready Solution)

About Konlida: Precision, Innovation, and Trust

Since the initial R&D phase in 2012 and mass production in 2017, Suzhou Konlida Precision Electronics Co., Ltd. has been dedicated to advancing EMI shielding and thermal management materials.

Our Core Advantages:

• In-House Material Integration:
  From conductive PI film to extruded silicone, Konlida achieves total control over quality, cost, and delivery.

• Certified Quality System:
  Compliant with ISO9001 and IATF16949, equipped with precision instruments such as film thickness gauges, 2.5D measurement systems, and salt spray testers.

• Fast Response & Customization:
  With complete material stock, orders can be fulfilled within 2 days. Urgent requests receive priority production scheduling.

As electronic devices continue to evolve toward miniaturization and higher integration, a stable grounding and EMI shielding solution becomes indispensable.
Konlida SMT gasket delivers reliability, precision, and long-term stability, redefining how the electronics industry manages electromagnetic challenges.

(Discover the next evolution of conductive foam: SMT Gaskets Design for Manufacturability: Ensuring Seamless Integration into Automated Production Lines)