Air Loop Gasket: A Lightweight EMI Shielding Design Guide for Next-Gen Devices

Air Loop Gasket Overview

The Air Loop Gasket is a next-generation lightweight EMI shielding solution designed for compact and high-performance electronics. Its hollow D-shaped structure, formed entirely from conductive fabric without internal foam, overcomes the limits of traditional conductive foam in weight, compression force, and design flexibility.

Core Structure

• Conductive fabric shell delivering 360-degree EMI shielding

• Hollow tubular profile reducing weight and compression force

• Custom geometries including straight, curved, and hybrid 3D shapes

To better understand conductive foam technologies, see related applications in Conductive Foam Selection Guide: Choosing the Right Material for Your Application  from our internal library.

Four Technical Breakthroughs

These advantages align with modern device requirements such as 5G modules, lightweight computing, and automotive electronics. For more guidance on gasket selection, refer to our Fabric over foam resource.

Five-Step Design and Selection Guide

Step 1. Select the Basic Structure

• Straight Air Loop for linear shielding paths

• Curved Air Loop for corners and tight radii

• Hybrid Air Loop for complex multi-segment geometries

Step 2. Choose the Conductive Fabric

Match fabric type to operating environments:

Step 3. Define Key Dimensions

Fabric width determines forming accuracy.

Parameter definitions

• Cross-section perimeter: 2 × (H + W) – 4 × T

• Fabric allowance: 0.2–0.3 mm

• Final fabric width: perimeter + allowance

Example
H = 2.0 mm, W = 1.5 mm, T = 0.1 mm
Perimeter = 6.6 mm
Final fabric width = 6.8 mm

Step 4. Validate Performance Targets

• EMI shielding: ≥ 60 dB (30 MHz–3 GHz)

• Surface resistance: ≤ 0.05 Ω/in

• Compression force: must meet system limit

• Long-term compression set: ≥ 85% recovery

Step 5. Confirm Manufacturing Feasibility

• Check internal space for wire routing

• Define assembly protection requirements

• Decide whether suction-tube support is required

Application Scenarios and Measured Performance

Scenario 1. Ultra-thin Tablet EMI Shielding

Challenge
A 12.9-inch tablet required a 5.2 mm working height, but traditional foam generated >10 kg force, distorting the panel.

Air Loop Result

• Customized curved Air Loop Gasket

• Resistance < 0.5 Ω at 4.5 mm compression

• Resistance < 0.3 Ω at 3.84 mm compression

• Total pressure <120 g per 8 mm

Scenario 2. Fully Enclosed Server Chassis

Comparison

Parameter	Traditional Foam	Air Loop Gasket
Total Pressure	15 kg	3.5 kg
Weight	45 g/m	18 g/m
Shielding	75 dB	70 dB
Lifespan	3 years	>5 years

Common Technical Issues and Mitigation

1. Dimensional Stability

Cause: hollow structure sensitive to humidity and tension
Solution: low-shrinkage fabric and climate-controlled production

2. Seam Splitting

Cause: insufficient adhesive width
Solution: minimum seam width ≥ 2 mm

3. Height Consistency

Cause: material elasticity and fabrication tolerance
Solution: precise tension control and internal suction-tube support

For additional insight into board-level EMI grounding strategies, see our SMT Gasket guide.

Why Konlida Is Your Best Manufacturing Partner

Technology Leadership

• Early developer and mass-producer of Air Loop Gasket solutions in China

• Multiple patents covering structural design and manufacturing processes

Quality System

• Automated wrapping and forming equipment

• 100 percent inline inspection

Proven Deployments

Air Loop Gaskets have been widely used in:

• Ultra-thin laptops

• High-end medical devices

• Automotive dashboards and EMC sealing

If your project involves weight-critical or space-restricted EMI shielding requirements, provide your available space, environmental conditions, and performance targets. Our engineering team will deliver a customized Air Loop Gasket design and supporting samples.